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微喷孔聚酰亚胺表面持续性亲水工艺

Hydrophilic retention process of micro nozzle on polyimide surface
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摘要 在聚酰亚胺材料上加工用于喷墨打印头的喷孔时,广泛采用激光打孔后填充亲水聚合物使喷孔内壁具有一定的亲水性,从而有利于提升打印头的工作频率。为了简化喷孔的制备工艺,本文提出一种使用氧气与氩气混合等离子体处理的方法,在引入亲水基团的同时增大表面粗糙度,克服通常等离子体处理中聚酰亚胺表面亲水性随着时间增加而逐渐丧失的局限,以期能够长时间维持亲水性。实验结果表明,经过长时间放置后,聚酰亚胺表面能够维持一定的亲水性,表面的接触角能够保持在50°~60°。最后,通过仿真分析验证了亲水性提升对于喷墨打印中墨滴填充的有利影响,墨滴填充时间由140μs缩短至70μs。 When processing the polyimide material used to fabricate the nozzles of an inkjet printer head,it is necessary for the inner wall of the nozzle to be hydrophilic so that the operating frequency of the print head can be maximized.Currently,laser drilling followed by hydrophilic polymer filling is commonly used to achieve this.In an attempt to simplify the nozzle preparation process,the present study set out to devise a plasma-based method using a mixture of oxygen and argon,to simultaneously introduce hydrophilic groups and increase the surface roughness,overcome the issue of hydrophilicity loss with an increase in the duration of the plasma processing,and ensure that the hydrophilicity is maintained throughout the lifetime of the print head.The results of our experiments reveal that the surface of the polyimide continues to be hydrophilic after an extended duration,with a surface contact angle maintained in 50°-60°.The results of a simulation-based analysis demonstrate that the hydrophilic enhancement has a beneficial effect on droplet filling in the print head,with the fill time being shortened from 140 to 70μs.
作者 赵翔 贾志新 张康生 李勇 周凯 ZHAO Xiang;JIA Zhi-xin;ZHANG Kang-sheng;LI Yong;ZHOU Kai(School of Mechanical Engineering,University of Science and Technology Beijing,Beijing 100083,China;Beijing Key Lab of Precision/Ultra-precision Manufacturing Equipments and Control,Departement of Mechanical Engineering,Tsinghua University,Beijing 100084,China)
出处 《光学精密工程》 EI CAS CSCD 北大核心 2018年第9期2198-2204,共7页 Optics and Precision Engineering
基金 苏州-清华创新引领专项资助(No.2016SZ0304)
关键词 喷墨打印 混合气体 等离子体 聚酰亚胺 微喷孔 亲水性 inkjet printing mixed gas plasma polyimide micro nozzle hydrophilic
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