摘要
现代大型医疗设备智能化程度越来越高,大规模集成电路IC芯片的应用也越来越普遍。这些大规模集成电路设备故障率高且复杂,难以检测和修复,拆焊上百脚以上的贴片集成芯片给维修工作人员带来很大困难,稍疏忽就可造成人工损坏而报废,进而造成巨大经济损失。因此,医疗设备大规模集成电路维修工作人员目前面前的最艰巨的任务就是研究多引脚贴片和球栅阵列封装(BGA)芯片如何拆焊的方法,最终研制成功一台简单方便、易移动和操作、经济适用、适合个体维修、安全可靠的医疗设备集成电路芯片IC多功能智能拆焊仪。
The degree of intelligence is higher and higher in the large modern medical equipment,and the large-scale IC chips are also widely used.It is high,complex,and difficult to detect and repair faults in these large-scale integrated circuit equipments.It is very difficult for maintenance workers to dismantle the chip integrated chip with hundreds of feet.A little neglect may cause artificial damage and being scrapped,and a great economic loss is formed.Hence the most difficult task for the artificial maintenance workers in the large-scale integrated circuit of medical equipment is to study how to dismantle the multi-pin patch and ball grid array package(BGA)chip.In the end,a simple and convenient,easy to carry and operate,economical application,suitable for individual maintenance,safe and reliable medical device integrated circuit chip IC multi-function desolde ring instrument is developed successfully.
作者
段文清
寸仙娥
周兴朝
杨林江
周和良
杨浡
Duan Wenqing;Cun Xiane;Zhou Xingchao;Yang Linjiang;Zhou Heliang;Yang Bo(Equipment Section,The First Affiliated Hospital of Dali University,Dali Yunnan 671000;The Basic Computer Teaching and Research Office,Dali University,Dali Yunnan 671000,China)
出处
《医疗装备》
2018年第21期38-40,共3页
Medical Equipment
基金
国家自然基金项目(8186070255)
关键词
医疗设备
IC拆焊技术
多功能智能拆焊仪
Armarium
IC desoldering technology
Multi-function intelligent desoldering instrument
