摘要
文章综述了金刚石工具向光伏、LED和半导体等新兴领域的发展,指出了金刚石工具越来越精细化的趋势;介绍了单晶硅、多晶硅和蓝宝石加工过程中用到的金刚石工具,其中对金刚石线锯、高精密金刚石砂轮、金刚石超薄划片、高精度套料钻头和CMP修整器在文章中做了重点介绍,最后就国内金刚石工具的发展趋势做了简单阐述。
This paper reviewed the development of diamond tools in photovoltaic,LED and semiconductor fields,and pointed out its refinement trend.The diamond tools used in processing single crystal silicon,polysilicon and sapphire were introduced with focuses on diamond wire saw,diamond grinding wheel,ultra-thin diamond dicing saw,sapphire bit,and CMP dresser.Finally,the development trend of domestic diamond tools was briefly described.
作者
徐良
刘一波
徐强
XU Liang;LIU Yi-bo;XU Qiang(Beijing Gang Yan Diamond Products Company,Beijing 102200,P.R.China)
出处
《超硬材料工程》
CAS
2018年第6期47-51,共5页
Superhard Material Engineering
关键词
单晶硅
多晶硅
蓝宝石
金刚石线锯
砂轮
single crystal silicon
polysilicon
sapphire
diamond wire saw
grinding wheel
