摘要
目的探讨牙周牙髓联合病变应用半导体激光治疗的效果。方法选取我院收治的60例牙周牙髓联合病变患者随机分为两组,其中常规组30例患者行牙周基础治疗+常规根管治疗;研究组30例则同时应用半导体激光治疗。结果研究组总体疗效显著高于常规组,组间差异显著;差异有统计学意义(P<0.05)。结论在牙周基础治疗以及常规根管治疗的同时,为牙周牙髓联合病变患者予以进一步的半导体激光治疗,具有更加确切的效果,值得临床借鉴。
objective To investigate the effect of semiconductor laser treatment on combined periodontal endodontic lesions.Method Sixty patients with combined periodontal and pulpal lesions were randomly divided into two groups,30 patients in the conventional group received periodontal basic therapy plus conventional root canal therapy,and 30 patients in the study group received semiconductor laser therapy.Result The overall efficacy of the study group was significantly higher than that of the conventional group,and there was a significant difference between the two groups(p<0.05).Conclusion In addition to basic periodontal therapy and conventional root canal therapy,semiconductor laser therapy for patients with combined periodontal and pulpal lesions is more effective and worthy of clinical reference.
作者
焦阳
杜毅
JIAO Yang;DU Yi(Binzhou Medical College,Shandong Yantai 264003,China;Jinan Stomatological Hospital,Shandong Jinan 250000,China)
出处
《全科口腔医学电子杂志》
2018年第35期14-14,18,共2页
Electronic Journal of General Stomatology
关键词
牙周牙髓联合病变
半导体激光
治疗效果
Combined periodontal endodontic lesions
Semiconductor laser
Therapeutic effect
