摘要
随着红外焦平面探测器向大面阵、多维度(例如双/多波段)信息获取、高灵敏度的第三代探测器技术发展,对红外成像光学系统的设计、光学元件加工、光学膜镀制、红外光学系统装调与测试等方面提出了新需求。本文在简述第一代热成像系统红外光学、第二代红外/热成像红外光学的基础上,梳理了第三代红外/热成像系统对红外光学的要求,综述了第三代红外成像光学系统解决这些新要求的技术进展,并展望了新技术的发展趋势。
New challenges are emerging in multiple fields along with the development of the third generation infrared detector toward large format,multiple-dimension information acquisition and high sensitivity.These fields include the designing of infrared optical systems,fabrication of optical elements,coating of optical thin films,mounting and measurement of the infrared optical systems.In this work,the first and second generation infrared optical systems are briefly presented.Then the demands for the third generation infrared optical system are analyzed.Finally,the recent progress and perspectives of the third generation infrared optical system are elaborated.
作者
王岭雪
蔡毅
WANG Lingxue;CAI Yi(School of Optics and Photonics,Beijing Institute of Technology,Beijing 100081,China;China Research and Development Academy of Machinery Equipment,Beijing 100089,China;Beijing Key Laboratory of Nanophotonics and Ultrafine Optoelectronic Systems,Beijing 100081,China)
出处
《红外技术》
CSCD
北大核心
2019年第1期1-12,共12页
Infrared Technology
基金
国家自然科学基金项目(61471044)
关键词
红外成像系统
热像仪
红外成像光学系统
infrared imaging system
thermal imager
infrared optical system
