摘要
针对大功率集成设备的散热瓶颈问题,建立了一种微热管模块数学模型,应用数值模拟方法研究不同加热功率不同风速下的微热管模块热性能。模拟结果表明微热管基板表面的平均温度比铜基板降低7～10℃.微热管基板表面最大温差在3℃以内,表明了微热管在高热流密度时能够有效扩散集中热源并具有优良均温特性。分别分析加热功率,空气流速以及导热翅片对微热管模块传热性能的影响特性,发现微热管模块在热流密度180 W,空气流速2.5 m·s^(-1)以及导热翅片20片时热扩散性能达到最优。模拟表明该微热管模块能够最大限度避免基板的热应力集中,从而保证功率模块的高效平稳运行。
Aiming at the thermal diffusion bottleneck of high-power integrated equipment,a mathematical model of micro-heat pipe module is established.The numerical simulation method is used to study the thermal performance of micro-heat pipe modules under different heating powers and different air velocity.The results show that the average temperature of the surface of the micro-heat pipe substrate is 7~10℃lower than that of the copper substrate.The maximum temperature difference is within 3℃,which indicates that the micro-heat pipe can effectively diffuse the concentrated heat source and has excellent uniform temperature characteristics at high heat flux density.Besides,the effects of heating power,air flow rate and heat transfer fins on the thermal transfer performance of the micro-heat pipe module are analyzed respectively.It is found that the optimal thermal diffusion performance is achieved at a heat flux density of 180 W,an air flow rate of 2.5 m·s^-1 and 20 pieces of heat transfer fins.The simulation shows that the micro heat pipe module can avoid the thermal stress concentration of the substrate to the maximum extent,thereby ensuring efficient and smooth operation of the power module.
作者
贺德佳
张亚平
姬长发
张栓伟
HE De-jia;ZHANG Ya-ping;JI Chang-fa;ZHANG Shuan-wei(College of Energy Science and Engineering,Xi’an University of Science and Technology,Xi’an 710054,China)
出处
《西安科技大学学报》
CAS
北大核心
2019年第3期419-425,共7页
Journal of Xi’an University of Science and Technology
基金
国家自然科学基金(51504188)
关键词
微平板热管
数值模拟
热性能
热阻
micro heat pipe
numerical simulation
heat transfer performance
thermal resistance
