摘要
在多芯片组件中,微波传输线间一般使用金丝键合的方式进行连接。受金丝自身的等效电感和其与基板及壳体间存在的寄生电容的影响,键合金丝结构在毫米波频段下带来了较大的阻抗失配。为了解决该问题,文中从等效集总元件角度出发,对阻抗变换公式进行了推导,分析得出串联低阻抗传输线可以等效为并联集总电容的结论,可以与键合金丝的等效模型一起,构成等效低通滤波器,完成阻抗匹配。文中使用共面波导结构制作了键合金丝匹配结构测试件,测试结果显示,在30~40GHz内S11<-20dB、 S21>-0.2dB,具有优良的传输性能。该结构具有较强的实用性,可以用于毫米波频段下的微波组件设计。
In multi -chip modules, transmission lines are generally connected by wire bonding. However, the equivalent inductance of the bonding wire and the parasitic capacitance lead to significant impedance mismatch in millimeter waves. In order to solve this problem, this work started with the equivalent circuit method and found that a serial of low-impedance transmission line is equivalent to parallel capacitance, which can be connected with the equivalent circuit of bonding wire to form a high-stage low-pass filter to complete the impedance matching. Furthermore, the grounded coplanar waveguide is used as the transmission line to fabricate animpedancematching structure. The test results showed that S11<-20dB, S21>-0.2dB in30-40 GHz, indicating that the impedance matching structure can be utilized for module design in millimeter waves.
作者
徐靖雄
刘骁
喻忠军
XU Jingxiong;LIU Xiao;YU Zhongjun(University of Chinese Academy of Sciences,Beijing 100049,China;Institute of Electronics,Chinese Academy of Sciences,Beijing 100190,China)
出处
《电子元件与材料》
CAS
CSCD
北大核心
2019年第6期96-99,共4页
Electronic Components And Materials
关键词
毫米波
共面波导
金丝键合
阻抗匹配
宽带
millimeter waves
grounded coplanar waveguide
bond-wire
impedance matching
broadband
