摘要
利用金相显微镜、扫描电镜(SEM)、能谱分析(EDS)等手段,研究了回流温度对Sn-58Bi焊点显微组织及剪切强度的影响。结果表明:回流焊接后,Sn-58Bi/Cu钎焊接头的金属间化合物(IMC)层主要以Cu6Sn5相为主,IMC层厚度随回流温度的升高而增加。Sn-58Bi焊点剪切强度随回流温度的增加呈先增加后降低的趋势。IMC层过厚,将导致界面层脆性激增,产生裂纹,使剪切强度急速下降。回流温度在180℃~200℃范围内时,剪切强度最佳。
The effects of reflow temperature on the microstructure and shear strength of Sn-58Bi solder joints were investigated by means of metallographic microscope, scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS).The results show that the intermetallic compound (IMC) layer of Sn-58Bi/Cu brazed joint is mainly Cu6Sn5 phase after reflow soldering, and the thickness of IMC layer increases with the increase of reflow temperature.The shear strength of Sn-58Bi solder joints increases first and then decreases with the increase of reflow temperature.If the thickness of the IMC layer is too thick, the brittleness of the interface layer increases and the crack generates, and the shear strength drops rapidly. The shear strength is the best when the reflux temperature is in the range of 180-200℃.
作者
范鹏
赵麦群
孙杰
孙聪明
FAN Peng;ZHAO Maiqun;SUN Jie;SUN Congming(College of Material Science and Engineering,Xi'an University of Technology,Xi'an 710048,China)
出处
《热加工工艺》
北大核心
2019年第17期168-171,共4页
Hot Working Technology
基金
陕西省教育厅重点实验室科研计划项目资助(14JS069)
