摘要
导电胶是由导电填料分散在树脂基体中,经过固化后形成的具有导电性能的复合材料,它是一种非常重要的无铅连接材料。本文概述了导电胶的两种不同的固化工艺,即热固化工艺和光固化工艺,并阐述了其固化动力学特性,展望了导电胶固化技术未来的发展趋势。
Conductive adhesive,which is a kind of a conductive composite material formed by curing conductive filler in resin matrix,is a very important lead-free bonding material.In this paper,different curing processes of conductive adhesives are summarized,including thermal curing and UV curing.The curing kinetic properties are described,and the development trend of curing processes of conductive adhesive was prospected.
作者
熊文杰
胡伟
王全勇
麦裕良
高敏
张磊
李水霞
Xiong Wenjie;Hu Wei;Wang Quanyong;Mai Yuliang;Gao Min;Zhang Lei;Li Shuixia(Guangdong Research Institute of Petrochemical and Fine Chemical Engineering,Guangzhou 510665;GRG Banking Equipment Co.,Ltd.,Guangzhou 510640,China)
出处
《广东化工》
CAS
2019年第17期87-89,共3页
Guangdong Chemical Industry
基金
广东省科学院创新驱动发展能力建设专项(2018GDASCX-0802,2018GDASCX-0116,2017GDASCX-0850)
关键词
导电胶
固化
复合材料
conductive adhesives
cure
compositematerial
