摘要
目的:通过研究光强光谱提取相应特征值作为化学机械抛光(CMP)终点监测判定方法。方法:首先由QE PRO光谱仪测得光强光谱,再通过移动平均滤波对信号进行滤波降噪,从处理后的信号中提取相应的信号特征值,并用两组数据对特征值进行分析以排除偶然性。结果:所发现的特征值:某一波峰与左拐点的波长差,具有良好的线性关系,并且计算量小,计算速度快。结论:发现的特征值可以作为CMP终点监测判定方法之一。
Aims: To extract the corresponding eigenvalue by researching the light intensity spectrum as Chemical Mechanical Polishing (CMP) endpoint monitoring and determination method. Methods: Firstly, measuring the light intensity spectrum by QE PRO spectrometer. Then, using moving average filtering to denoise the signal. After that, extracting the corresponding eigenvalue from the processed signal. Using two sets of data to analyze the eigenvalue to eliminate the occasionality. Results: The eigenvalue found is the wavelength difference between the peak and the left inflection point, which has a good linear relationship with less calculation and faster speed. Conclusions: The eigenvalue can be used as one of the CMP endpoint monitoring methods.
作者
狄韦宇
郑永军
卫银杰
DI Weiyu;ZHENG Yongjun;WEI Yinjie(College of Metrology and Measurement Engineering,China Jiliang University,Hangzhou 310018,China)
出处
《中国计量大学学报》
2019年第3期308-316,共9页
Journal of China University of Metrology
基金
国家自然科学基金项目(No.51775530)
国家重大科技专项(No.2015ZX02101)
