摘要
采用常压烧结法制备了铜–石墨–氧化锡（Cu–C–SnO2）复合多孔材料,对其物相组成和物理性能进行了分析测试,研究了SiO2–B2O3–Al2O3系助焊剂对Cu–C–SnO2多孔材料组织和性能的影响。结果表明,加入适量助焊剂有助于铜–石墨–氧化锡混合粉体烧结;助焊剂加入量（质量分数）在5%以下时,铜–石墨–氧化锡粉末烧结体的透气性和硬度随着助焊剂质量分数的增加而降低,粉末烧结体的导电性和烧结收缩率随着助焊剂质量分数的增加而升高;在730～770℃烧结,烧结温度对铜–石墨–氧化锡混合粉体的烧结工艺特性和烧结体性能影响不大。
Cu–C–SnO2 composite porous materials with different addition contents of SiO2–B2O3–Al2O3 scaling powder by mass were prepared by pressureless sintering, the phase composition and physical properties of Cu–C–SnO2 porous materials were analyzed and tested, and the effects of scaling powder contents on the microstructures and properties of Cu–C–SnO2 porous composites were investigated. The results show that, the suitable content of scaling powder is conducive to the sintering of Cu–C–SnO2 mixture powders. When the scaling powder content is not excess 5% by mass, the gas permeability and hardness of the sintered compact decrease with the increase in scaling powder content, but the electroconductibility and sintering shrinkage increase as the scaling powder content increases. Meanwhile, the sintering temperature has little influence on the sintering performance of Cu–C–SnO2 mixture powders and the properties of sintered compact at the range of 730～770 ℃.
出处
《粉末冶金技术》
CAS
CSCD
北大核心
2018年第5期335-341,共7页
Powder Metallurgy Technology
基金
河南省自然科学基金资助项目(0111040400)
关键词
常压烧结
多孔材料
助焊剂
显微组织
物理性能
pressureless sintering
porous materials
scaling powder
microstructures
physical properties
