摘要
随着对印制电路板散热能力的要求提高,业界引入了埋嵌铜块制造技术。文章从埋嵌铜块设计、叠层结构、关键生产工艺、产品相关检测和可靠性等方面研究与分析,系统阐述了一种新型埋嵌铜块印制电路板的设计和关键工序的制造方法。
With the development of the requirement of heat dissipation ability of PCB,the manufacturing technology of embedded copper PCB is introduced in the industry.In this paper,the design of embedded copper block,laminated structure,key production technology,product-related detection and reliability are studied and analyzed.The design of embedded copper block printed circuit board and the manufacturing method of key processes are systematically expounded.
作者
陈志宇
唐德众
Chen Zhiyu;Tang Dezhong
出处
《印制电路信息》
2019年第9期48-53,共6页
Printed Circuit Information
关键词
埋铜块
棕化
散热技术
可靠性测试
Embedded Copper
Brown Oxidation
Cooling Technology
Reliability Tests
