摘要
随着功率器件特别是第三代半导体的崛起与应用,半导体器件逐渐向大功率、小型化、集成化、多功能等方向发展,对封装基板性能也提出了更高要求。陶瓷基板(又称陶瓷电路板)具有热导率高、耐热性好、热膨胀系数低、机械强度高、绝缘性好、耐腐蚀、抗辐射等特点,在电子器件封装中得到广泛应用。本文分析了常用陶瓷基片材料(包括Al2O3、AlN、Si3N4、BeO、SiC和BN等)的物理特性,重点对各种陶瓷基板(包括薄膜陶瓷基板TFC、厚膜印刷陶瓷基板TPC、直接键合陶瓷基板DBC、直接电镀陶瓷基板DPC、活性金属焊接陶瓷基板AMB、激光活化金属陶瓷基板LAM以及各种三维陶瓷基板等)的制备原理、工艺流程、技术特点和具体应用等进行了论述,最后对电子封装陶瓷基板发展趋势进行了展望。
With the development and application of power device,especially the third-generation semiconductor,semiconductor devices are gradually becoming high power,miniature,integration and multi-function,which puts higher requirements to the substrate.Ceramic substrate has properties of high thermal conductivity,good thermo-stability,low thermal expansion coefficient,excellent mechanical strength,outstanding insulation,superior corrosion resistance and radio-resistance,thus applying widely in electronic packaging.In this paper,the physical characteristics of common ceramic substrate raw materials(including Al2O3,AlN,Si3N4,BeO,SiC and BN)were analyzed.The emphasis was put on the fabrication principle,process flow,properties and applications of various ceramic substrates,including thin film ceramic substrate(TFC),thick printing ceramic substrate(TPC),direct bonded ceramic substrate(DBC),direct plated ceramic substrate(DPC),active metal brazing ceramic substrate(AMB),laser activation metallization(LAM),and varieties of three-dimensional ceramic substrate.Finally,the development tendency of ceramic substrate was discussed.
作者
程浩
陈明祥
罗小兵
彭洋
刘松坡
CHENG Hao;CHEN Ming-Xiang;LUO Xiao-Bing;PENG Yang;LIU Song-Po(School of Mechanical Science&Engineering,Huazhong University of Science and Technology,Wuhan 430074,China;School of Energy and Power Engineering,Huazhong University of Science and Technology,Wuhan 430074,China;Wuhan LEDSTAR Technology Co.,Ltd,Wuhan 430074,China)
出处
《现代技术陶瓷》
CAS
2019年第4期265-292,共28页
Advanced Ceramics
基金
国家自然科学基金(51775219)
国家重点研发计划项目(2016YFB04008)
科技部中小企业技术创新项目(14C26214202320)
湖北省技术创新专项重大项目(2016AAA069)
广东省应用型科技研发专项重点项目(2016B010129001)
关键词
陶瓷基板
三维陶瓷基板
电子封装
热管理
功率器件
Ceramic substrate
3D ceramic substrate
Electronic packaging
Thermal management
Power device
