摘要
随着电子产品向小型化、轻量化、多功能方向的发展,越来越多的塑封微电路(PEM)被应用于高可靠领域。由于封装材料的本质特性,PEM与气密封装微电路相比存在固有弱点。因此,在质量、价格、进度和性能等多种因素的综合影响下,可能需要选用存在分层缺陷的PEM,此类PEM在有高可靠性要求的领域使用存在一定的风险。为降低风险,提高使用者对此类PEM的信心,根据PEM的特点和环境剖面,提出有针对性的PEM分层评价思路。
With the rapid development of microelectronic technology,more and more plastic encapsulated microcircuits(PEMs)are applied in the field of high reliability.However,due to the intrinsic properties of packaging materials,PEMs have inherent weaknesses compared with sealed microcircuits.Therefore,under the comprehensive influence of quality,price,progress,performance and other factors,PEMs with delaminations may be chosen,although with certain risk.In order to reduce risks and improve users'confidence in such PEMs,a risk evaluation method for delaminated PEMs is proposed.
作者
王伯淳
杨城
WANG Bochun;YANG Cheng(The Metrology and Measurement Institute of Hubei Space Academy,Xiaogan 432000,China;Ruijie Networks Co.,Ltd.,Fuzhou 350000,China)
出处
《电子与封装》
2019年第9期10-14,共5页
Electronics & Packaging
关键词
塑封微电路
高可靠领域
分层评价
plastic encapsulated microcircuit
high reliability
risk evaluation
