摘要
为了有效解决电路芯片热量过高和温度分布不均匀的问题,结合热管强化传热技术与冷板强化散热技术的优点,研制了基于航空电子设备元器件安装空间尺寸的热管冷板散热装置。利用ICEPAK仿真软件对其进行了热仿真分析,通过比较仿真结果所示的温度云图,确定了热管在冷板上的最佳分布情况,并对冷板上的散热翅片进行优化设计。同时,对仿真结果进行了实验验证,结果表明:所设计的热管冷板散热性能和板面均温性良好,能较好地满足设计要求;ICEPAK热仿真软件计算结果与实验验证结果较为接近,在热设计阶段具有可行性。
In order to solve high heat and non-uniform temperature distribution of the circuit chip,the advantages of the technology of heat transfer enhancement of heat pipe was combined with the strengthen of cooling technology of cold plate.A heat pipe cold plate equipment is developed based on mounting space of components of aviation electronic equipment.It has carried on the analysis of thermal simulation using the ICEPAK simulation software,and determined the optimal distribution of heat pipe in the cold plate by comparing the simulation results of the temperature contour,then the cooling fin on the cold plate is optimized.At the same time,the simulation results are verified by experiments,and the results showed that,the designed heat pipe cold plate has very good heat radiation performance and temperature uniformity,it can better meet the design requirements.The calculation results of thermal simulation software of ICEPAK can be consistent with the experimental results,and it is feasible in the thermal design stage.
作者
李健
房磊
林小平
王凯
LI Jian;FANG Lei;LIN Xiao-ping;WANG Kai(College of Mechanical Engineering,Changzhou University,Jiangsu Changzhou213164,China)
出处
《机械设计与制造》
北大核心
2019年第10期28-30,共3页
Machinery Design & Manufacture
基金
江苏省产学研联合创新资金-前瞻性联合研究项目资助(BY2014037-24)
关键词
热管
ICEPAK
散热装置
均温性
Heat Pipe
ICEPAK
Radiating Device
Temperature Uniformity
