摘要
铂金丝作为低温器件封装中理想的键合丝,其键合质量的优劣决定着整个器件的性能和可靠性。通过25μm的铂金丝球形键合试验,并使用OLYMPUS SMT-6三轴测量显微镜观察键合点形貌并测量第一键合点根部直径。结果表明,当超声功率介于0.96~1.2 W时,增加超声功率有助于提高键合强度,增加工艺稳定性。在文中所设实验条件下,为保证键合强度和工艺稳定性,超声功率设置为1.2~1.28 W时最佳。第一焊点键合球平均直径为2.8 WD(WD表示键合线直径)时,键合强度最大,工艺稳定性最好。总结出了键合点直径与拉力值关系图,从而通过键合点直径来评价键合质量。
As an ideal bonding wire in cryogenic device packaging, the bonding quality of platinum wire determines the performance and reliability of the whole device. The spherical bonding experiment of platinum wire at 25 μm was carried out. The morphology of bonding point and the diameter of the first bonding point were observed by OLYMPUS SMT-6 triaxial measuring microscope. The results show that when the ultrasonic power increases from 0.96 W to 1.2 W, the increase of ultrasonic power is helpful to improve bonding strength and process stability. Under the experimental conditions set in this paper, in order to ensure bonding strength and process stability, the optimal ultrasonic power is set from 1.2 W to 1.28 W. When the average diameter of the first bonding point is 2.8 times WD, the bonding strength is the largest and the process stability is the best. The relation diagram between bonding point diameter and pull force was summarized, and bond quality was evaluated by bonding point diameter.
作者
赵振力
孙闻
ZHAO Zhenli;SUN Wen(State Key Laboratory of Transducer Technology,Shanghai Institute of Technical Physics,Chinese Academy of Sciences,Shanghai 200083,China;Key Laboratory of Infrared Imaging Materials and Devices,Shanghai Institute of Technical Physics,Chinese Academy of Sciences,Shanghai 200083,China)
出处
《电子与封装》
2019年第11期4-8,共5页
Electronics & Packaging
关键词
超声功率
铂金丝
球形键合
质量评价
ultrasound power
platinum wire
spherical bonding
quality evaluation
