摘要
针对砂轮划片机重复划片会降低芯片的加工精度,甚至损坏芯片的问题,基于Halcon软件平台提出一种提高划片精度的轨迹识别与规划方法。该方法结合了双线性插值和亚像素边缘检测算法,实现了轨迹的识别,进一步规划下次划片轨迹,并且提高划片精度。以被砂轮划片机划片芯片为实验背景,完成了对划片轨迹的识别与规划。实验结果表明,所提出的算法与传统的Canny算法比较,可以有效提高轨迹识别的精度,进而提高划片的精度。
Aiming at the problem that repeated dicing for the grinding wheel dicing machine will reduce the processing precision of the chip and even damage the chip,based on the Halcon software platform,a trajectory identification and planning method for improving the dicing accuracy was proposed.The method combines bilinear interpolation and sub-pixel edge detection algorithm to realize the recognition of the trajectory,further plan the next scribe trajectory,and improve the dicing precision.Taking the dicing chip of the grinding wheel dicing machine as the experimental background,the identification and planning of the dicing trajectory was completed.The experimental results show that compared with the traditional Canny algorithm,the proposed algorithm can effectively improve the accuracy of trajectory recognition and improve the accuracy of dicing.
作者
魏哲
张阳
张明明
孟繁滨
WEI Zhe;ZHANG Yang;ZHANG Mingming;MENG Fanbin(School of Mechanical Engineering,Shenyang Jianzhu University,Shenyang 110168,China;Shenyang Heyan Technology Co.,Ltd.,Shenyang 110122,China)
出处
《机械与电子》
2019年第12期38-41,共4页
Machinery & Electronics
基金
辽宁省教育厅科研专项(LJZ2016018)
