摘要
采用引线键合技术对集成电路进行封装时,键合丝与Al焊盘存在异质界面问题,对电子器件的使用性能有很大的影响。本文综述了键合参数、界面金属间化合物(IMC)演变行为及工作环境等方面对界面键合强度和可靠性影响的研究进展,并展望了未来发展前景。
When the integrated circuit is packaged by wire bonding technology,the bonding wire and the Al pad have a heterointerface problem,which has a great influence on the performance of the electronic device.In this paper,the research progress of bonding parameters,interfacial intermetallic compound(IMC)evolution behavior and working environment on interface bonding strength and reliability is reviewed,and the deve-lopment of bonding interface research methods are prospected.
作者
彭成
梁爽
黄福祥
钟明君
冉小杰
PENG Cheng;LIANG Shuang;HUANG Fuxiang;ZHONG Mingjun;RAN Xiaojie(College of Material Science and Engineering,Chongqing University of Technology,Chongqing 400054)
出处
《材料导报》
EI
CAS
CSCD
北大核心
2019年第S02期501-504,共4页
Materials Reports
基金
国家重点研发计划(2016YFB0402602)~~
