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耐高温气凝胶隔热材料研究进展 被引量:10

Research Progresses on High Temperature Resistant Aerogel Insulation Materials
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摘要 气凝胶是一种由胶粒或者聚合物单体相互聚合构成的具有三维网络骨架的固体纳米材料,具有超低密度、低热导、高比表面积和高孔隙率等优异性能。气凝胶材料的孔隙率在90%以上,且气凝胶材料内部的介孔结构使得气凝胶具有极佳的隔热性能。同时,气凝胶材料的低热导率和高耐温性可以让其在高温下仍能保持良好的三维纳米网络结构,不会发生高温烧结现象。因此,气凝胶材料在轻质耐高温防隔热材料领域得到了广泛关注。本文重点介绍了耐高温气凝胶隔热防护材料耐温性能研究及发展现状,且对耐高温气凝胶隔热防护材料的发展进行了展望。 Aerogel is a kind of solid nanometer material with three-dimensional(3D)network skeleton composed of colloidal particles or polymer monomers.It has excellent properties such as ultra-low density,low thermal conductivity,high specific surface area,and high porosity.Aerogel has excellent thermal insulation properties since its porosity is over 90%and its internal structure is mesoporous.Meanwhile,the low thermal conductivity and high temperature resistance of aerogel enable it to maintain a good 3D nano-network structure at high temperatures without high-temperature sintering.Therefore,aerogel has received extensive attention in the lightweight,high-temperature resistant,and heat insulating material fields.In this paper,the research and development status of the high-temperature resistant properties of high-temperature resistant aerogel insulation materials are mainly introduced,and the development of high-temperature resistant aerogel insulation materials is prospected.
作者 锁浩 王伟 江胜君 崔升 沈晓冬 朱小飞 吴晓栋 SUO Hao;WANG Wei;JIANG Shengjun;CUI Sheng;SHEN Xiaodong;ZHU Xiaofei;WU Xiaodong(Department of Materials Science and Engineering,Nanjing Tech University,Nanjing 210009,Jiangsu,China;Jiangsu Collaborative Innovation Center for Advanced Inorganic Function Composites,Nanjing Tech University,Nanjing 210009,Jiangsu,China;Shanghai Space Propulsion Technology Research Institute,Huzhou 313000,Zhejiang,China)
出处 《上海航天》 CSCD 2019年第6期61-68,共8页 Aerospace Shanghai
基金 教育部创新团队资助项目(1RT_15R35) 江苏省高校自然科学研究重大资助项目(15KJA430005) 江苏省研究生科研与实践创新计划资助项目(KYCX17_0977) 江苏省重点研发(产业前瞻与共性关键技术)资助项目(BE2016171,BE2017151) 宿迁市科技计划资助项目(M201704) 江苏省高校优势学科建设工程资助项目
关键词 气凝胶 纳米 隔热 耐温性 热导率 aerogel nanometer insulation high temperature resistant thermal conductivity
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