摘要
为解决磁耦数字隔离器的瞬态共模抑制(CMTI)不能准确测试的问题,研究了磁耦合数字隔离器瞬态共模抑制的测试及耦合机理。对耦合电阻、电容两个耦合参数进行了仿真验证,对仿真得到的器件输出波形进行抓取与分析,说明了电路中不同测试条件对仿真结果的影响。以ADI公司的典型磁耦数字隔离器ADUM1200型为例,采用小电容大电阻模型模拟实际耦合,分析并且明确了耦合电容大小状态,验证磁耦合数字隔离器瞬态共模抑制仿真方法是否具有一定的有效性。
In order to solve the problem which cannot accurately test the Common Mode Transient Immunity(CMTI)of high speed Magnetic-coupler,we study the coupling mechanism and the testing principle of the Common Mode Transient Immunity(CMTI)of Magnetic-coupler.Using the simulation technology to simulate and verify the circuit function and the tow coupling resistance and coupling capacitance coupling parameters of the Common Mode Transient Immunity evaluation circuit.The effects of different device parameters on the simulation results are analyzed.And the output waveform of the data to be read and analysed.Take ADUM1200 of ADI company as an example,using the model of parallel connection of large resistance and small capacitance can accurately simulate the coupling condition of evaluating CMTI performance.The size of the coupling capacitance is determined through simulation analysis.And to verify the effectiveness of the Common Mode Transient Immunity of high-speed Magnetic-coupler transient simulation method.
作者
徐昕
陈品君
刘路扬
高会壮
Xu Xin;Chen Pinjun;Liu Luyang;Gao Huizhuang(Beijing saidI Junxin electronic products testing laboratory Co.,Ltd,Beijing,100089)
出处
《电子测试》
2020年第1期8-10,37,共4页
Electronic Test
关键词
耦合参数
瞬态共模抑制
磁耦数字隔离器
PSPICE仿真
Common Mode Transient Immunity
high-speed Magnetic-coupler
PSpice simulation
coupling parameter
