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大功率半导体激光器热沉技术研究

Research on heat sink technology of high-power semiconductor laser
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摘要 文章选取AuSn过渡热沉替代原来的In焊料,克服了In焊料引起的器件寿命使用偏低、针对激光器结温影响大等缺点,并对过渡热沉的结构设计和焊接工艺做了进一步研究,设计出新型AuSn过渡热沉的焊装结构。经过结温—漏电流测试可以得到更为优良的散热效果,外推寿命从6134 h提高到20363 h,提高了器件的可靠性。 In this paper,AuSn heat sink is selected to replace the original in solder to overcome the shortcomings of solder,such as low device life and great influence on laser junction temperature,and a new welding structure of AuSn heat sink is designed.Through the test of junction temperature and leakage current,better heat dissipation effect can be obtained.The extrapolation life can be increased from 6134 hour to 20363 hour,the reliability of the device is improved.
作者 芦鹏 刘国军 Lu Peng;Liu Guojun(School of Optoelectronic Engineering,Changzhou Institute of Technology,Changzhou 213032,China;State Key Laboratory of High-Power Semiconductor Laser,Changchun University of Science and Technology,Changchun 130022,China)
出处 《无线互联科技》 2019年第23期109-110,共2页 Wireless Internet Technology
关键词 大功率半导体激光器 AuSn 过渡热沉 结温 high power semiconductor laser AuSn transition heat sink junction temperature
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