摘要
目的解决电子设备高热流密度芯片散热问题。方法建立主板模块传导冷却的热阻网络,设计研制一种低热阻结构的热管冷板,并对两种热管冷板在不同热流密度条件下进行模块及整机的常温和高温试验。结果常温试验中,CPU和GPU芯片温度在模块试验中下降了14.3℃和5.4℃,在整机试验中下降了7.2℃和6.1℃;高温试验中,CPU和GPU芯片温度在模块试验中下降了10.2℃和4.2℃,在整机试验中下降了9.1℃和7.5℃。结论热管冷板能提高整机环境适应性及可靠性,其结构设计方法可推广用于电子设备散热设计。
The paper aims to solve the heat dissipation problem of electronic equipment chip with high heat flux density. A thermal resistance network of the conduction cooling for the mother board was built, and a heat pipe cold plate with low thermal resistance was designed and manufactured, then normal and high temperature tests of the two types of heat pipe cold plate for module and equipment were carried out under different heat fluxes. The normal temperature tests showed that the temperatures of the CPU and GPU were reduced by 14.3 ℃ and 5.4 ℃ respectively during the module tests, and which were dropped by 7.2 ℃ and 6.1 ℃ respectively during the equipment tests. The high temperature tests showed that the temperature of the CPU and GPU were reduced by 10.2 ℃ and 4.2 ℃ respectively during the module tests, and which were dropped by 9.1 ℃ and 7.5 ℃ respectively during the equipment tests. The heat pipe cold plate can improve the environmental adaptability and reliability of the equipment. This structure design method can be applied to electronic equipment cooling.
作者
曾乐业
李翔
ZENG Le-ye;LI Xiang(Hunan Branch of Beijing StarElec Technology Co.,Ltd.,Changsha 410006,China;School of Aeronautics and Astronautics,UESTC,Chengdu 611731,China)
出处
《装备环境工程》
CAS
2020年第1期109-113,共5页
Equipment Environmental Engineering
关键词
热管冷板
热阻网络
常温试验
高温试验
heat pipe cold plate
thermal resistance network
normal temperature test
high temperature test
