期刊文献+

水-气缩流导光机制仿真与试验研究 被引量:1

Simulation and Experimental Study on Water-gas Shrinkage Light Guiding Mechanism
下载PDF
导出
摘要 基于水导激光加工技术,提出一种新型水-气缩流导光加工技术,并针对水-气缩流与全反射导光特性进行了仿真分析。结果显示:利用流体仿真得到0.5 mm缩径至0.1 mm的水柱缩流参数进行光学仿真,激光光斑在轴向偏移8.5 mm、径向偏移0.3 mm和角度偏移20°条件下,均能使耦合效率超过95%。通过试验分析验证了水-气缩流传导激光加工技术的工艺可行性,为水导激光低损伤、高精度、大厚度材料加工奠定理论基础。 Based on the water-guided laser processing technology,a new water-gas shrinkage light-guided processing technology is proposed,and the water-air shrinkage and total reflection light-guided characteristics are simulated and analyzed.The analysis results show that the waterjet diameter used for optical simulation can be ruduced from 0.5 mm to 0.1 mm through fluid simulation.The laser spot can meet the coupling efficiency above 95%under the conditions of axial offset 8.5 mm,radial offset 0.3 mm and angular offset 20°.In addition,through experiments,the article verified the feasibility of the water-gas shrinkage conduction laser processing technology,which lays a theoretical foundation on the water-guided laser processing of low-damage,high-precision and large-thickness materials.
作者 张广义 潮阳 张正 郭春海 张文武 ZHANG Guangyi;CHAO Yang;ZHANG Zheng;GUO Chunhai;ZHANG Wenwu(Institute of Advanced Manufacturing Technology,Ningbo Institute of Materials Technology and Engineering,Chinese Academy of Sciences,Ningbo 315201,China)
出处 《电加工与模具》 2020年第1期47-51,共5页 Electromachining & Mould
基金 国家自然科学基金资助项目(51805525) 中国博士后科学基金面上项目(2017M621984) 国家商用飞机制造工程技术研究中心创新基金(COMAC-SFGS-201736742)
关键词 水导激光 水-气缩流 仿真分析 试验验证 water-guided laser water-gas shrinkage simulation analysis experimental verification
  • 相关文献

参考文献4

二级参考文献21

  • 1段瑞玲,段惠波,李庆祥,李玉和,杨再华.基于图像处理的微装配自动调焦系统[J].光学精密工程,2006,14(3):468-472. 被引量:28
  • 2郭锐,赵万生,李刚,李志勇,张勇.微细电火花加工的微细电极在线检测[J].光学精密工程,2006,14(6):998-1003. 被引量:10
  • 3赵岩,梁迎春,白清顺,王波,孙雅洲,陈明君.微细加工中的微型铣床、微刀具磨损及切削力的实验研究[J].光学精密工程,2007,15(6):894-902. 被引量:27
  • 4刘瑞安,靳世久,吴晓荣,张希坤.视线跟踪系统中CCD摄像机的自适应调节[J].光学精密工程,2007,15(6):966-972. 被引量:11
  • 5Richerzhagen B. Water-Guided Laser Processing [J]. Industrial Laser Review Nov, 1997:8- 10.
  • 6SYNOVA Report. Laser-Microjet-A New Method for Material Processing [R]. Lausanne, Switzerland, 1998.
  • 7Li C F, Johnson D B, Kovacevic R. Modelling of Waterjet Guided Laser Grooving of Silicon [J]. Int. J. Machine Tools & Manufacture, 2003, 43:925-936.
  • 8WANG Y, L1 L, YANG L J, et al. Simulation and Experimental Research on Water-jet Guided Laser Cutting Silicon Wafer[C]//2008 International Conference on Electronic Packaging Technology &: High Density Packaging, Vol.sl and 2. USA: IEEE, 2008:826- 831.
  • 9Webb B W, Ma C F. Signal-Phase Liquid Jet Impingement Heat Transfer [J]. Adv. Heat Transfer, 1995, 26: 105-217.
  • 10Lehane C, Kwok H S. Enhanced Drilling Using a Dual-Pulse Nd:YAG Laser [J]. Appl. Phys. A: Materials Science & processing, 2001, (73): 45-48.

共引文献34

同被引文献5

引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部