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固溶处理冷却方式对Cu/Al复合板界面微观组织的影响 被引量:2

Effect of Cooling Method on Interface Microstructure of Cu/Al Clad Sheet by Solution Treatment
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摘要 利用光学显微镜、扫描电镜、X射线衍射等手段研究了冷却方式(水冷、空冷和炉冷)对Cu/Al复合板界面微观组织的影响,利用显微硬度仪测试了冷却方式对铸轧Cu/Al复合板力学性能的影响。实验结果表明:铸轧复合板界面形成Al2Cu、AlCu、Cu9Al4、AlCu3四种金属间化合物,经500℃×2 h固溶处理后,界面扩散层厚度增加,形成Al2Cu、AlCu、Al2Cu3、Cu9Al4、AlCu3五种金属间化合物。水冷和空冷界面扩散层产生孔洞,炉冷孔洞基本消失,解释了孔洞形成原因及变化过程,孔洞等缺陷会削弱界面层的结合强度。铸轧复合板界面扩散层厚度小、硬度低;经固溶处理后,界面扩散层厚度和硬度均增加,并随冷却速度的减小,厚度和硬度进一步增加。剥离过程中,铸轧复合板靠近Al基体断裂,而经固溶处理后的复合板断裂在界面扩散层。随冷却速度的下降,裂纹扩展能力减弱,过厚的金属间化合物不利于复合板的结合。 The effect of cooling mode( water cooling,air cooling,furnace cooling) on the interface microstructure of Cu/Al clad sheet was studied by means of optical microscopy,scanning electron microscopy and X-ray diffraction. And the effect of cooling mode on the mechanical properties of cast rolled Cu/Al clad sheet was tested by microhardness testers. The experimental results indicate that five kinds of intermetallic compounds,i. e. Al2Cu,AlCu,Al2Cu3,Al4Cu9,AlCu3 were formed at the interface layer after solution treatment at 500 ℃ ×2 h. There can be found holes in the diffusion layers after water cooling and air cooling,but nearly no holes on the interface after furnace cooling. The reason of holes forming and the change process of holes were studied. The defects such as holes will weaken the bonding strength of interface layer. The interfacial diffusion layer of the as-cast and rolled sheet is thin and the hardness is low. After solution treatment the thickness and hardness will be increased,and a lower cooling rate can result in a thicker and harder diffusion layer. During the stripping process,the cast and rolled sheet fractured near the Al matrix,and the solution-treated sheet fractured at the interface diffusion layer. With the decrease of the cooling rate,the crack propagation ability gets weaken,which indicates that excessively thick intermetallic compounds are not conducive to the combination of the clad sheet.
作者 刘玉洁 蒋显全 佘欣未 王浦全 冉洋 彭和 冉贞德 LIU Yujie;JIANG Xianquan;SHE Xinwei;WANG Puquan;RAN Yang;PENG He;RAN Zhende(College of Materials and Energy,Southwest University,Chongqing 400715,China;Advanced Materials Research Center,Chongqing Academy of Science and Technology,Chongqing 401123,China;College of Engineering and Technology,Southwest University,Chongqing 400715,China;Chongqing Institute of Optics and Mechanics,Chongqing 401122,China;Chongqing Gearbox Co.,Ltd.,Chongqing 402260,China)
出处 《材料导报》 EI CAS CSCD 北大核心 2020年第10期10132-10137,共6页 Materials Reports
基金 国家自然科学基金(51971183) 重庆市自然科学基金(cstc2019jcyj-msxmX0594) 重庆市技术创新与应用发展项目(cstc2019jscx-mbdxX0036)。
关键词 Cu/Al复合板 固溶处理 界面扩散 金属间化合物 空冷 炉冷 水冷 Cu/Al clad sheet solution treatment interface diffusion intermetallic compound air cooling furnace cooling water cooling
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