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基于SMT的X波段微带环行隔离组件的设计

Design of X-band microstrip circulator isolation components based on surface mount technology
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摘要 采用表面贴装技术(SMT)研制了X波段的微带环行隔离组件,研究了金属化过孔对旋磁铁氧体基片传输信号的影响。通过对旋磁铁氧体基片进行金属化过孔,将器件的输出端口引入底部,使产品的体积减小,而且减少了安装工艺的复杂度。使用电磁仿真软件HFSS对X波段的微带环行隔离组件进行仿真优化。结果表明,微带环行隔离组件在X波段内8.5~10.5 GHz频段,可以达到相对带宽21.1%,插入损耗小于0.65 dB,端口电压驻波比小于1.30,两个隔离度分别大于18 dB和大于30 dB,仿真结果与实测结果基本一致。 A X-band microstrip circulator isolation component was developed by surface mount technology(SMT).And metallized through-holes in gyromagnetic ferrite substrates were studied for their effect on the transmission signal.By making the metallized through-holes in the gyromagnetic ferrite substrates,the output port of the device was introduced from the bottom,which reduced the volume of the product and simplified the installation process.The X-band microstrip circulator isolation component was optimized by electromagnetic simulation software HFSS.The simulation shows that the relative bandwidth of the microstrip circulator isolation component is 21.1%from 8.5 to 10.5 GHz in X-band with insertion loss smaller than 0.65 dB and VSWR of the port not larger than 1.30.The simulated two isolation degrees are larger than 18 dB and larger than 30 dB.The simulation results are basically consistent with the measured results.
作者 魏巍 王代强 WEI Wei;WANG Daiqiang(College of Big Data and Information Engineering,Guizhou University,Guiyang 550025,China;Institute of Mechanical Electrical Engineering,Guizhou Minzu University,Guiyang 550025,China)
出处 《电子元件与材料》 CAS CSCD 北大核心 2020年第4期80-83,共4页 Electronic Components And Materials
基金 国家自然科学基金(11564005) 贵州省教育厅创新群体重大研究项目(黔教合KY字[2017]035)。
关键词 SMT 微带环行隔离组件 HFSS软件 铁氧体 环行器 X波段 surface mounting technology microstrip circulator isolation component high frequency structure simulator software ferrite circulator X-band
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