摘要
扩散焊连接的双合金整体叶盘可能会在界面处产生缺陷,采用超声检测是控制界面缺陷的最佳方案,然而声阻抗差异和复杂的几何结构给超声检测的准确性和可靠性带来极大困难。本文提出一种利用90°声反射镜将超声波信号入射到盘件内孔孔壁的检测方法,实现了双合金整体叶盘连接界面的检测。在灵敏度、信噪比等方面实验研究了该方法对于双合金整体叶盘界面的检测能力。结果表明,本文方法的检测灵敏度可以达到Ф2.0mm平底孔当量,在实际盘件的检测中超声检测结果与金相分析结果吻合较好,验证了本方法的可靠性。
Defects may sometimes develop within the interface of a diffusion bonded dual-alloy blisk and the ultrasonic evaluation is the best method of controlling the interface defects.However,the acoustic impedance difference and complex geometry bring great difficulty to the accuracy and reliability of ultrasonic evaluation.An evaluation method is proposed in this paper,in which the ultrasonic signal is introduced into the inner hole wall of the blisk with a 90°acoustic mirror,realizing the ultrasonic evaluation of bonding interface of dual-alloy blisk.Experiments are conducted to study the evaluation capability of the proposed method for bonding interface of dual-alloy blisk in terms of sensitivity and SNR,etc.Results show that the evaluation sensitivity of the proposed method can reach a flat-bottomed hole equivalent of Ф2.0 mm,and the ultrasonic evaluation results are in good agreement with those of metallographic analysis,verifying the reliability of the proposed method.
作者
沙正骁
梁菁
韩波
SHA Zhengxiao;LIANG Jing;HAN Bo(AECC Beijing Institute of Aeronautical Materials,Beijing,100095,China;Beijing Key Laboratory of Aeronautical Materials Testing and Evaluation,Beijing,100095,China;Key Laboratory of Science and Technology on Aeronautical Materials Testing and Evaluation,Aero Engine Corporation of China,Beijing,100095,China)
出处
《数据采集与处理》
CSCD
北大核心
2020年第2期231-238,共8页
Journal of Data Acquisition and Processing
基金
国家自然科学基金(51505449,51575541)资助项目。
关键词
双合金整体叶盘
扩散焊
超声检测
dual-alloy blisk
diffusion bonding
ultrasonic evaluation
