摘要
随着高端芯片不断向微型化、集成化发展,其"热障"问题日益突显,已经成为阻碍芯片向更高性能发展的重要挑战,发展新型的高性能冷却技术迫在眉睫。基于液态金属的对流冷却技术、液态金属热界面材料以及基于低熔点金属相变材料的相变温控技术等,均在冷却能力上实现了较传统冷却技术量级上的提升,给大量面临"热障"难题的器件和装备的冷却带来了全新的解决方案。以千瓦级超级芯片为例,探讨液态金属对于突破其"热障"难题起到的关键作用,并试图推动液态金属先进冷却技术在未来超级芯片冷却领域的发展和应用。
As high-profile chips continue to develop towards highly miniaturization and integration,their"thermal barrier"problem becomes increasingly prominent,and even becomes the major bottleneck that hinders their development.Hence,it is imminent to develop high-performance chip cooling and thermal management technologies to tackle this challenge.As a class of newly emerging high-performance thermal management materials,liquid metals have revolutionized the concepts and technologies in the areas of convection cooling,thermal interface materials,and phase change thermal control.The liquid metals enabled cooling technologies breakthrough the performance limit of conventional cooling methods,and provide powerful solutions for the cooling of devices and equipment which are faced with tough"thermal barrier"issues.In this paper,our attention will be focused on the cooling of superchips with operation power up to a thousand Watt;liquid metal cooling technologies are expected to play the key role in breaking through their tough"thermal barrier"problem.We hope that this paper will help promote the development and application of liquid metal cooling technologies in the cooling of the upcoming superchips.
出处
《节能》
2020年第3期124-127,共4页
Energy Conservation
关键词
液态金属
高性能芯片冷却
热障
微通道热沉
热界面材料
相变材料
liquid metal
high performance chip-cooling
thermal barrier
micro-channel heat sink
thermal interface materials
phase change materials
