摘要
Sn-Pb软钎焊料由于润湿性好、性能优良,是电子封装领域主要运用的传统软钎焊材。Pb有毒不符合绿色发展的理念,减少Pb的使用能保护环境和人体健康,必须研发新型无铅焊料替代传统的Sn-Pb焊料。新型的低温软钎焊料包括Sn-Bi, Sn-In两系合金。本文总结了Sn-Pb焊料的优点和缺点,与Sn-Pb焊料相比较阐述了Sn-Bi, Sn-In系低温无铅焊料的性能。分析了In, Bi的相互作用对锡基无铅焊料组织及性能的影响。低温的Sn-Bi-In系合金绿色无污染,将是一种能够运用于消费电子产品的新型无铅焊料合金。通过相图计算可以筛选较优的合金成分,为Sn-Bi-In无铅焊料的设计和性能研究提供参考,因此Sn-Bi-In三元系相图的计算尤为重要。文章中论述了Sn-Bi-In系合金的相图计算研究现状及热力学模型,收集整理了一些Sn-Bi-In三元合金的相结构参数和热力学数据,同时结合了CALPHAD说明了将相图计算运用于新型Sn-Bi-In焊料开发的优势。
The traditional soldering material of Sn-Pb is mainly used in the field of electronic packaging due to its good wettability and excellent performance. Lead poison is not in line with the concept of green development, reducing the use of lead can protect the environment and human health. So new lead-free solders must be developed to replace traditional Sn-Pb solders. The new low-temperature solder includes Sn-Bi and Sn-In alloys. The paper summarized the advantages and disadvantages of Sn-Pb solders, and elaborated the performance of Sn-Bi and Sn-In low-temperature lead-free solders compared with Sn-Pb solder. The effects of interaction between In and Bi on microstructure and properties of Sn-based lead-free solders were analyzed. The low-temperature Sn-Bi-In alloy was green and non-polluting and would be a new lead-free solder alloy that could be used in consumer electronics. The phase diagram calculation could be used to screen the better alloy composition, which provided a reference for the further study of Sn-Bi-In lead-free solder. Therefore, the phase diagram calculation of the Sn-Bi-In ternary system was particularly important. The current research and thermodynamic model of phase diagram calculation of Sn-Bi-In alloys were discussed. The phase structure parameters and thermodynamic data of some Sn-Bi-In ternary alloys were collected. Meanwhile, CALPHAD was combined to illustrate the advantages of applying phase diagram calculation to the development of new Sn-Bi-In solders.
作者
李威
李萌蘖
卜恒勇
Li Wei;Li Mengnie;Bu Hengyong(Faculty of Material Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China)
出处
《稀有金属》
EI
CAS
CSCD
北大核心
2020年第2期195-204,共10页
Chinese Journal of Rare Metals
基金
云南省重大科技专项项目(2018ZE010)资助。
