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精细丝网印刷电子影响因素及实验研究 被引量:7

Influencing Factors and Experimental Research of Fine Screen Printing Electrons
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摘要 目的为了分析网版参数、印刷工艺和油墨粘度对丝网印刷过程的影响情况及影响程度。方法以印品线宽、线厚和印刷粗糙度为评价指标,根据精细丝网的印刷过程,采用静态描述法建立油墨向网孔中填墨、油墨从网孔向承印物转移以及油墨在承印物上的流平铺展的物理模型;采用实验方法探究网版参数、印刷工艺和油墨粘度对丝网印刷过程的影响;建立相同印刷条件下,各个影响因子对应的线宽数值,线宽越小,其影响程度就越大的描述模型,以对影响因子进行比较。结果结合最小网点直径与网版目数、线径的数学模型,获知网版的选择与最小网点直径有关,最小网点直径越小,所选网版就越好;在一定范围内,刮刀角度越小,刮刀压力越大,刮刀速度越大,其印品质量就越好,超出这个范围就会影响其印品质量;离网间距不宜过大,也不宜过小,在刮刀角度为60°,刮刀速度为0.08 m/s下的离网间距最佳为2mm;纳米银导电油墨粘度对印刷质量的影响不是同步变化,若追求低厚度和小粗糙度印品,则选择低粘度油墨;若追求低线宽,则选择高粘度油墨。结论精细丝网印刷质量影响程度由高到低排序为网版参数>刮刀压力>离网间距>油墨粘度>刮刀角度>刮刀速度。 The work aims to analyze the influence of screen parameters, printing process and ink viscosity on screen printing process. With the print line width, line thickness and printing roughness as the evaluation indexes, the physical models of ink filling the mesh, ink transfer from the mesh to the substrate and ink spreading on the substrate were established in the static description method according to the fine screen printing process. The effect of screen parameters, printing process and ink viscosity on the screen printing process was explored by conducting experiments. Under the same printing conditions, the description model for the line width value corresponding to each influencing factor was established to compare the influencing factors. The narrower the line width was, the greater the influence degree of the description model was. Combined with the mathematical model for the minimum dot diameter, mesh number and line diameter, it was known that the selection of the screen was related to the minimum dot diameter. The smaller the minimum dot diameter was, the better the selected screen was. In a certain range, the smaller the doctor blade angle, the greater the doctor blade pressure and the faster the doctor blade speed, the better the quality of the printed matter. Beyond this range, the quality of the printed matter would be affected. The off-screen spacing should be neither too wide nor too narrow. When the doctor blade angle was 60° and the doctor blade speed was 0.08 m/s, the best off-screen spacing was 2 mm. The influence of the viscosity of nano-silver conductive ink on the printing quality was not synchronous. In pursuit of the prints with low thickness and small roughness, the low viscosity ink should be selected. In pursuit of the narrow line width, the high viscosity ink should be selected. The order of the influence degree of the following factors on the fine screen printing quality from high to low is screen parameters>doctor blade pressure>off-screen spacing>ink viscosity>doctor blade angle>doctor blade speed.
作者 刘世朴 李艳 张彦辉 LIU Shi-pu;LI Yan;ZHANG Yan-hui(Beijing Institute of Graphic Communication Beijing Key Laboratory of Digitization Printing Equipment,Beijing 102600,China;Research Center of Printing Equipment of Beijing Universities,Beijing 102600,China;Beijing Engineering Research Center of Printed Electronics,Beijing 102600,China;School of Mechanical Engineering,University of Science and Technology Beijing,Beijing 100083,China)
出处 《包装工程》 CAS 北大核心 2020年第13期243-250,共8页 Packaging Engineering
基金 科技创新服务能力建设项目(Ec201714)。
关键词 精细丝网 印刷电子 柔性电子 影响因素 fine screen printed electronics flexible electronics influencing factors
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  • 1许伟光.浅谈影响玻璃网版印刷图案清晰的相关因素[J].网印工业,2010(8):44-47. 被引量:3
  • 2唐正宁,李飞,翁星光,安君.丝网印版的分辨率特性研究[J].包装工程,2006,27(2):90-93. 被引量:6
  • 3RIEMER D E. The Theoretical Fundamentals of the Screen Printing Process[J]. Hybrid Circuits, 1989,18 ( 2 ) : 8 -- 17.
  • 4OWCZAREK J A, HOWEAND F L. A Study of the Offcontact Screen Printing Process-part I: Model of the Printing Process and Some Results Derived from Experiments[J].IEEE Transactions on Components and Packaging Technologies, 1990,13 (2) : 358-367.
  • 5OWCZAREK J A, HOWLAND F L. A Study of the Off- contact Screen Printing Process-part II: Analysis of the Model of the Printing Process[J]. IEEE Transactions on Components and Packaging Technologies, 1990,13 ( 2 ) : 368--375.
  • 6KAY R, STOYANOV. Ultra-fine Pitch Stencil Printing for a Low Cost and Low Temperature Flip-chip Assembly[J]. IEEE Transactions on Components and Packaging Technologies, 2007,30 ( 1 ) : 129 -- 136.
  • 7KAY R,DESMULIEZ M. Low Temperature Flip-chip Packaging Based on Stencil Printing Technology [C]. Proceedings of the IMAPS Micro Tech Conference, Ettington Chase, 2003.
  • 8RAGHU D,PETER H.Analysis of printed electronics forecasts in 2008[EB/OL].[2007-06-17].http://www.IDTechEX.com.
  • 9PETER H.Introduction to printed electronics[EB/OL].[2010-02-14].http://www.IDTechEX.com.
  • 10PETER H,RAGHU D.Printed and thin film transistors and memory 2009-2029[EB/OL].[2010-06-24].http://www.IDTechEX.com.

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