摘要
针对电子设备单芯片热耗超过500 W、热流密度超过50 W/cm^2、单个机柜超过50 kW的散热需求,采用沸腾换热结合微槽道的方法为大热耗、高热流芯片散热提供了新的解决方案。通过试验验证了微槽道与常规通道蒸发器的流动和换热差异。结果表明,微槽道相比常规流道,其散热温差降低了44%,细长结构的微槽道蒸发器能获得更优越的换热性能,流动沸腾换热系数可达2~3 W/(cm^2·K)。
For the cooling requirements of electronic equipment that the heat consumption of single chip is more than 500 W,the heat flow density is more than 50 W/cm^2 and the heat consumption of single cabinet is more than 50 kW,the method of boiling heat transfer combined with micro channel provides a new solution to the heat dissipation of the chips with high heat consumption and high heat flow.The differences of flow and heat transfer between micro channel evaporator and conventional channel evaporator are verified by experiment.The results show that the micro channel can reduce the temperature difference of heat dissipation by 44%compared with the conventional channel.The micro channel evaporator with slender structure can obtain better heat transfer performance and the flow boiling heat transfer coefficient can reach 2~3 W/(cm^2·K).
作者
刘帆
李帅
陶成
LIU Fan;LI Shuai;TAO Cheng(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518055,China)
出处
《电子机械工程》
2020年第3期22-25,29,共5页
Electro-Mechanical Engineering
关键词
微槽道
沸腾
散热
micro channel
boiling
heat dissipation
