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分级歧管微通道阵列散热器流动与散热特性研究 被引量:7

Flow and Thermal Characteristics Research on Hierarchical Manifold Microchannel Heat Sink Array
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摘要 针对航天器通信、激光、雷达等高功率载荷关键部件面临的高热流密度散热难题,开展分级歧管微通道阵列散热器研究。通过歧管结构引入射流效应并缩短散热通道长度,在保证高效散热的同时降低流动阻力。在10 mm×10 mm的硅芯片上使用微机电系统(MEMS)工艺加工3×3阵列的微通道散热器,散热器中微通道宽度为40μm,深度分别为40μm,150μm,300μm。搭建试验装置并研究散热器的流动与散热特性,通过改变入口流率、通道深度及工质种类获得不同参数对歧管微通道散热器内单相流动和散热性能(即压降、温度分布及换热系数)的影响,并在压降小于40 kPa的条件下实现了超过平均450 W/m^2的散热能力。文章的研究成果可用于航天器高功率载荷的高效散热。 Regarding to the reliability issues of components caused by high heat flux in spacecraft control and communications systems, lasers, radars, and other loads, a hierarchical manifold microchannel heat sink array is researched. The jet effect is introduced through the manifold structure and the flow length of the heat sink is shortened, which reduces the flow resistance while ensuring efficient heat dissipation. A 10 mm×10 mm silicon chip is fabricated using MEMS(micro-electro-mechanical system) technology and the chip is cooled by a series of 3×3 microchannel heat sinks array. The depths of the heat sinks are 40, 150, and 300μm, respectively. The flow and thermal characteristics of the heat sink are investigated through test vehicle. Effects of inlet velocity, channel geometry and working fluid selection on the thermal characteristics of the manifold microchannel heat sink are studied in detail, including pressure drop, temperature distribution and heat transfer coefficient. A heat dissipation capacity exceeding 450 W/cm^2 on average is achieved while the pressure drop is less than 40 kPa. The results of this paper can be used for high efficiency heat dissipation of high-power loads in spacecraft.
作者 谢文远 吕晓辰 李龙 姚伟 XIE Wenyuan;LYU Xiaochen;LI Long;YAO Wei(Qian Xuesen Laboratory of Space Technology,Beijing 100094,China)
出处 《航天器工程》 CSCD 北大核心 2020年第4期99-107,共9页 Spacecraft Engineering
基金 国防基础科研项目(JCKY2017203C043) 国家自然科学基金(51806232)。
关键词 微通道散热器 分级歧管结构 单相流动 换热系数 microchannel heat sink hierarchical manifold structure single-phase flow heat transfer coefficient
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