期刊文献+

芯片产业加权专利合作网络研究 被引量:5

Research on Weighted Patent Cooperation Network of Chip Industry
下载PDF
导出
摘要 为揭示芯片专利合作网络的内在耦合机制以及互补机制,为决策者制定合理的产学研合作政策和芯片产业发展战略提供理论依据,以中国芯片产业为研究对象,运用社会网络分析方法,通过构建芯片产业加权专利合作网络,从网络结构、关联性、社群和重要节点等方面研究中国芯片产业加权专利合作网络的结构特征。研究结果表明:中国芯片产业加权专利合作网络具有幂律分布的特性;企业在芯片产业的专利合作申请中占据主导地位;北京、上海和广东等经济发达地区是该网络节点的重要组成;度值较大的专利申请人呈现明显的连接偏好,节点的权重比度值增加得更快,网络具有同配性质;国家电网公司是该网络中最为重要的节点,电子科技大学、台湾积体电路制造股份有限公司占据该网络的重要位置。据此,对提升中国芯片产业培育和发展提出对策建议。 In order to reveal the internal coupling mechanism and complementary mechanism of chip patent cooperation network, and provide theoretical basis for policy makers to formulate reasonable industry-universityresearch cooperation policies and chip industry development strategy, this paper takes China’s chip industry as the research object, uses social network analysis method, through the construction of weighted patent cooperation network of chip industry, studies the structural characteristics of weighted patent cooperation network of China’s chip industry from the aspects of network structure, relevance, community and important nodes. The results show that: the weighted patent cooperation network of China’s chip industry has the characteristics of power-law distribution;enterprises play a dominant role in patent cooperation applications of chip industry;economically developed regions such as Beijing, Shanghai and Guangdong are important components of the network nodes;patent applicants with higher degree value show obvious connection preference, the weight of nodes increases faster than degree value, and the network has the same matching property;the State Grid Corporation is the most important node in the network, and the University of Electronic Science and Technology of China and Taiwan Integrated Circuit Manufacturing Co., Ltd. occupy an important position in the network. Based on this, some suggestions are put forward to improve the cultivation and development of China’s chip industry.
作者 陈瑾宇 马丽仪 陶秋燕 刘晓雨 Chen Jinyu;Ma Liyi;Tao Qiuyan;Liu Xiaoyu(School of Management,Beijing Union University,Beijing 100101,China;International Business School,University of International Business and Economics,Beijing 100029,China)
出处 《科技管理研究》 CSSCI 北大核心 2020年第14期156-164,共9页 Science and Technology Management Research
基金 北京市社会科学基金项目“北京核心信息技术产业培育研究”(18GLB028) 教育部人文社会科学基金项目“基于集群网络结构视角的高技术产业集群风险演化及控制体系研究”(15YJCZH114)。
关键词 芯片产业 加权专利网络 社会网络分析 结构特征 chip industry weighted patent cooperation network social network analysis structural features
  • 相关文献

参考文献16

二级参考文献204

共引文献328

同被引文献99

引证文献5

二级引证文献8

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部