摘要
研究磁耦数字隔离器的陶瓷封装技术,分析了金丝球焊、硅铝丝楔焊经高温贮存后键合强度和键合失效模式的变化对可靠性的影响以及微变压器线圈压焊点的距离、腔体的压力、腔体里的气体种类对隔离电压的影响。研究结果表明,硅铝丝楔焊的可靠性更高;微变压器线圈压焊点的距离越大,腔体的压力越大,隔离电压越大;腔体内为电负性气体的隔离电压大于惰性气体。
The ceramic package for magnetic coupling digital isolator is studied.The changes of bonding strength and failure mode of the gold wire ball bonding,aluminum-silicon wedge bonding for reliability were analyzed,and the pad distance of micro transformer,the press and the gas type in cavity for the isolation voltage were analyzed.The research results show that the aluminum-silicon wedge bonding has higher reliability,the pad distance is greater,the pressure is higher,and the isolation voltage is greater.The isolation voltage of the electronegative gas is higher than that of the inert gas in cavity.
作者
敖国军
廖小平
杨兵
AO Guojun;LIAO Xiaoping;YANG Bing(China Key System&Integrated Circuit Co.,Ltd.,Wuxi 214072,China;Wuxi Zhongwei High-Tech Electronics Co.,Ltd.,Wuxi 214035,China)
出处
《电子与封装》
2020年第8期11-16,共6页
Electronics & Packaging
关键词
封装
隔离器
击穿电压
隔离电压
可靠性
package
isolator
breakdown voltage
isolation voltage
reliability
