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应用于电池热管理的均温板的温度特性研究 被引量:7

Temperature Characteristics of Vapor Chamber Applied in Battery Thermal Management
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摘要 本文以一款内部具有流道以及相变工质R1233zd的均温板为研究对象,将均温板置于冷源与热源之间,对其温度场进行了理论分析和仿真模拟,并通过搭建实验台,对均温板的温度特性进行了实验研究。实验结果表明:均温板表面温度分布与冷源表面温度分布具有良好的一致性。均温板表面温度分布受热源功率和冷源温度的影响:当热源功率由345 W升至690 W,而冷源温度保持0℃不变时,均温板表面平均温度由13.20℃升至25.84℃,表面温差由11.10℃升至25.70℃;当冷源温度由0℃降为-5℃,而热源功率保持690 W不变时,均温板表面平均温度由25.84℃降至18.15℃,表面温差由25.70℃降至16.60℃。在不同工况下,均温板热阻约为0.03 K/W,具有良好的导热性能。 In this study,a vapor chamber with an internal flow channel and a phase change working fluid R1233zd is studied.The vapor chamber is placed between the cold source and heat source.The temperature field of the vapor chamber is analyzed theoretically and by simulation.Furthermore,the temperature distribution is obtained by experiments.The experimental results show that the temperature distribution of the vapor chamber is consistent with that of the cold source.The temperature distribution is affected by the power of the heat source and the temperature of the cold source.When the power of the heat source rises from 345 W to 690 W and the temperature of the cold source remains at 0℃,the average temperature of the vapor chamber increases from 13.20℃to 25.84℃,and the temperature difference increases from 11.10℃to 25.70℃.When the temperature of the cold source reduces from 0℃to-5℃and the power of the heat source remains at 690 W,the average temperature of the vapor chamber decreases from 25.84℃to 18.15℃,and the temperature difference decreases from 25.70℃to 16.60℃.Under different working conditions,the thermal resistance of the vapor chamber is approximately 0.03 K/W,which shows that the vapor chamber has good thermal conductivity.
作者 李浩 刘金伟 施骏业 王惠惠 陈江平 Li Hao;Liu Jinwei;Shi Junye;Wang Huihui;Chen Jiangping(Institute of Refrigeration and Cryogenics, Shanghai Jiao Tong University, Shanghai, 200240, China;SONGZ Automobile Air Conditioning Co., Ltd., Shanghai, 201108, China;Shanghai New Energy Automotive Air Conditioning Engineering Technology Research Center, Shanghai, 201108, China)
出处 《制冷学报》 CAS CSCD 北大核心 2020年第4期59-67,共9页 Journal of Refrigeration
关键词 均温板 实验研究 温度场 相变工质 vapor chamber experimental study temperature field phase change working fluid
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  • 1李腾,刘静.芯片冷却技术的最新研究进展及其评价[J].制冷学报,2004,25(3):22-32. 被引量:66
  • 2唐琼辉,徐进良,李银惠,刘小龙.一种新型微热管传热性能的实验研究[J].热能动力工程,2006,21(4):350-354. 被引量:15
  • 3Brookner.相控阵和雷达技术的突破(英文)[J].现代雷达,2006,28(10):1-4. 被引量:6
  • 4张亚平,余小玲,周恩民,冯全科.新型径向平板热管传热性能的实验研究[J].西安交通大学学报,2007,41(7):780-783. 被引量:4
  • 5Sobhan C B, Garimella S V, Unnikrishnan V V. A computational model for the transient analysis of flat heat pipe [ C ] //Thermo Mechanical Phenomena in Electronic Systems Proceedings of the Intersociety Conference. 2000, 2: 106-113.
  • 6Vadakkan U, Murthy J Y, Garimella S V. Transient analysis of fiat heat pipes[ C ] //Proceedings of the 2003 ASME Summer Heat Transfer Conference. HT2003-47349, Las Vegas, NV ,2003 : 1 - 11.
  • 7Carbajal G, Sobhan C B, Peterson G P, et al. Thermal response of a flat heat pipe sandwich structure to a localized heat flux [ J]. International Journal of Heat and Mass Transfer, 2006, 49: 4070-4081.
  • 8Carbajal G, Sobhan C B, Peterson G P, et al. A quasi-3D analysis of the thermal performance of a flat heat pipe[ J]. International Journal of Heat and Mass Transfer, 2007, 50 : 4286-4296.
  • 9Hsieh S, Leea R, Shyub J, et al. Analytical solution of thermal resistance of vapor chamber heat sink with and without pillar[ J]. Energy Conversion and Management, 2007, 48: 2708-2717.
  • 10Koito Y, Imura H, Mochizuki M, et al. Numerical analysis and experimental verification on thermal fluid phenomena in a vapor chamber [ J ]. Applied Thermal Engineering, 2006,26 : 1669-1676.

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