摘要
针对三维芯片封装技术的需求,设计了一种基于高温共烧陶瓷(HTCC)的接收前端3D封装结构,通过有限元模型模拟分析了其可靠性。首先通过恒定加速度加载分析研究了焊盘结构可靠性;然后通过预应力模态分析研究了3D封装整体结构模态频率,通过疲劳可靠性分析研究了寿命预测模型;最后通过热模拟研究了稳态热分析以及热应力分析。结果表明:焊盘的应力应变以及位移满足其材料特性;3D封装整体结构谐振频率均在30 kHz以上;50%载荷作用下寿命为10~6次循环,150%载荷作用下寿命为74561次循环;稳态热分析最高温度为54.2℃;热应力模拟最大应力为33.84 MPa。最终证明了该接收前端3D封装结构是可靠的,可应用在3D射频微系统封装结构设计中。
To meet the requirements of 3 D chip packaging technology,a 3 D packaging structure of receiving front-end was designed,which was based on high temperature co-fired ceramics(HTCC).Its reliability was analyzed by finite element model simulation.Firstly,the structural reliability of the pad was studied by constant acceleration loading analysis.Then the modal frequency of the 3 D packaging structure was obtained by pre-stressed modal analysis,and the fatigue reliability analysis was used to study the life prediction model.Finally,the steady-state thermal analysis and thermal stress were studied by thermal simulation.The results show that the stress,strain and displacement of the pad is consistent with material characteristics.The vibration frequency of the 3 D packaging structure is beyond 30 kHz.The service life is 106 cycles under 50%load and 74561 cycles under 150%load respectively.The maximum temperature to perform steady-state thermal analysis is 54.2℃.The maximum thermal stress is 33.84 MPa.We concluded that the 3 D packaging structure of the receiving front-end is reliable,which could be applied in the design of 3 D RF microsystem packaging structure.
作者
傅显惠
刘德喜
赵红霞
祝大龙
FU Xianhui;LIU Dexi;ZHAO Hongxia;ZHU Dalong(Beijing Research Institute of Telemetry,Beijing 100094,China)
出处
《电子元件与材料》
CAS
CSCD
北大核心
2020年第9期105-110,共6页
Electronic Components And Materials
关键词
3D封装
可靠性
接收前端
有限元
应力
热设计
3D package
reliability
receiving front-end
finite element
stress
thermal design
