摘要
绝缘栅双极型晶体管(IGBT)功率半导体模块可靠性是生产应用中关注的重点。IGBT功率模块封装过程中,金属底板对模块的可靠性至关重要。在真空回流焊工艺环节过程中金属底板承受热应力产生翘曲,因此铜底板需要在封装前预弯形成向上的弧形。铜底板同时是功率模块的主要散热通道,绝缘衬底与金属底板之间的焊接层质量以及该焊接层的空洞率对IGBT模块工作性能和长期可靠性具有直接影响。通过实验研究同时考虑金属底板弧度和焊层空洞率下的焊接工艺,为国产IGBT封装技术提供了可靠的参考。
Reliability of insulated gate bipolar transistor(IGBT)power semiconductor module is the focus of production and application.The metal bottom plate is very important to the reliability of IGBT power module during the packaging of IGBT power module.In the process of vacuum reflow welding,the metal bottom plate undergoes warping under thermal stress,so the copper bottom plate needs to be prebent to form an upward arc before packaging.Copper bottom plate is also the main heat dissipation channel of the power module.The quality of the welding layer between the insulating substrate and the metal bottom plate has a direct impact on the performance and long-term reliability of IGBT module.The experimental study of the welding process under radian of metal base plate and void rate of welding layer is conducted to provide a reliable reference for IGBT packaging technology in China.
作者
郭新华
杨光灯
傅金源
GUO Xin-hua;YANG Guang-deng;FU Jin-yuan(Huaqiao University,Xiamen 361000,China;不详)
出处
《电力电子技术》
CSCD
北大核心
2020年第9期134-137,共4页
Power Electronics
基金
国家自然科学基金(51477058,51707068)
台州市科技计划(1901gy10)。
关键词
绝缘栅双极型晶体管
弧度
空洞率
可靠性
insulated gate bipolar transistor
radian
void fraction
reliability
