摘要
金刚石材料具备极高的热导率特性,在高功率电子设备散热领域有着广阔的应用前景。从雷达微波功率组件的金刚石热沉的制备入手,对金刚石材料焊接研究现状进行了综述,介绍了金刚石常用的焊接方法、钎料以及焊接温度场模拟现状,分析了焊后金刚石的磨损性能,揭示了服役过程中的失效形式。为提高金刚石热沉的制造精度、使用寿命等综合性能提供参考,也为未来金刚石微通道等散热器件的制备提供借鉴,加速推动我国高功率电子器件的发展。
Diamond materials have very high thermal conductivity,and have broad application prospects in the fi eld of heat dissipation of high power electronic equipment.Starting from the preparation of diamond heat sink for radar microwave power module,the current research status of diamond material soldering is summarized,the common soldering methods,solder and soldering temperature fi eld simulation of diamond are introduced,the wear performance of diamond after soldering is analyzed,and the failure forms during service are revealed.It provides reference for improving the comprehensive performance of diamond heat sink,such as manufacturing precision and service life,and also provides reference for the future preparation of heat dissipation devices such as diamond microchannel,so as to accelerate the development of highpower electronic devices in China.
作者
姜海涛
殷东平
方坤
JIANG Haitao;YIN Dongping;FANG Kun(The 38th Research Institute of CETC,Hefei 230088,China)
出处
《电子工艺技术》
2020年第5期252-255,共4页
Electronics Process Technology
基金
装备预研教育联合基金项目(6141A02033118)。
关键词
金刚石
钎焊
磨损性能
有限元模拟
diamond
brazing
wear resistance
fi nite element modelling
