摘要
随着集成电路持续向超大规模发展,其引线框架日益高精密化,对引线框架用铜合金板带材的性能提出了更高要求。综述了采用蚀刻法制造高精密引线框架对所用铜合金带材对力学性能、导电导热性能、尺寸精度、变形和表面质量、蚀刻性能的要求;介绍了国内外相关产业的发展历史和现状;分析了高精密蚀刻引线框架用铜合金板带的关键制造技术。最后论述了我国高强高导铜合金带材制造产业需重点突破的关键技术以及发展策略。
With the continuous development of integrated circuits to very large scale, the lead frame is becoming more and more precise, which put forward higher requirements for the performance of the Cu alloy strip for lead frame. The requirements on the mechanical properties, electrical and thermal conductivity, deformation and surface quality and etching performance of the Cu alloy strip used in the manufacture of high precision lead frame by etching method were summarized.The development history and current situation of related industries in China and abroad were introduced, and the key manufacturing technologies for the Cu alloy strip used in the high precision lead frame were analyzed. At last, the key technologies need to break through and the development strategies of the high strength and high conductivity Cu alloy strip manufacture industry in China were discussed.
作者
张青科
刘峰
冯小龙
杨丽景
宋振纶
ZHANG Qingke;LIU Feng;FENG Xiaolong;YANG Lijing;SONG Zhenlun(Ningbo Institute of Material Technology and Engineering,Chinese Academy of Sciences,Ningbo 315201,China;Ningbo Xingye Shengtai Group Co.,Ltd.,Ningbo 315336,China;Ningbo Kangqiang Electronics Co.,Ltd.,Ningbo 315105,China)
出处
《热加工工艺》
北大核心
2020年第20期6-9,14,共5页
Hot Working Technology
基金
宁波市“科技创新2025”重大专项资助项目(2019B10087)。
关键词
引线框架
蚀刻
铜合金
导电率
强度
lead frame
etching
Cu alloy
conductivity
strength
