摘要
以正硅酸乙酯(TEOS)为硅源,4,4′-二氨基二苯醚(ODA)为二胺单体,均苯四甲酸二酐(PMDA)为二酐单体,γ-氨丙基三乙氧基硅烷(APTES)为交联剂,采用溶胶-凝胶法结合相转化法制备聚酰亚胺/二氧化硅(PI/SiO2)复合多孔膜。探究了交联剂种类及加入比例对多孔膜结构和性能的影响,通过红外光谱、扫描电镜、导热系数测试仪及万能拉伸试验机对多孔膜进行性能表征。结果表明,多孔膜亚胺化完全,交联剂对PI基体的导热性能与力学性能有明显影响。交联剂APTES制备的复合多孔膜拉伸强度和弹性模量均比其他两种交联剂好,导热系数最低至0.043W/(m·K);随着APTES加入比例的增加,多孔膜拉伸强度由19.8MPa增大至21.2MPa,弹性模量由155.4MPa增大至207.6MPa。
Polyimide/silica(PI/SiO2)composite porous film was prepared by sol-gel method and phase conversion method,using ethyl orthosilicate(TEOS)as silicon source,4,4′amino diphenyl ether(ODA)as diamine monomer,PMDA as dihydride monomer,andγ-aminopropyltriethoxysilane(APTES)as crosslinking agent.The porous films were characterized by FT-IR,SEM,thermal conductivity tester and universal tensile testing machine.The results shown that the porous film imidization was completely,and the crosslinking agent had obvious influence on the thermal conductivity and mechanical property of PI matrix.The tensile strength and elastic modulus of the porous films with the thermal conductivity of 0.043 W/(m·K)prepared by APTES were better than others.With the increase of APTES,the tensile strength of porous film increased from 19.8 MPa to 21.2 MPa,and the elastic modulus increased from 155.4 MPa to 207.6 MPa.
作者
丁成成
俞娟
王晓东
黄培
Ding Chengcheng;Yu Juan;Wang Xiaodong;Huang Pei(State Key Laboratory of Materials-Oriented Chemical Engineering,College of Chemical Engineering,Nanjing Tech University,Nanjing 211800)
出处
《化工新型材料》
CAS
CSCD
北大核心
2020年第10期87-91,共5页
New Chemical Materials
关键词
聚酰亚胺
二氧化硅
交联剂
导热系数
力学性能
polyimide
silica
crosslinking agent
thermal conductivity
mechanical property
