摘要
采用真空熔炼制备了Cu-0.50Cr-xCo合金和Cu-0.50Cr-0.07Ti合金,研究了Co含量、变形量、时效温度和合金元素Co、Ti对合金的组织性能的影响。结果表明:随着Co含量的增加,Cu基体中的晶界处逐渐出现未固溶的Cr颗粒;随着变形量的增加,Cu-0.50Cr-xCo合金的显微硬度、抗拉强度分别从129.1HV和379MPa增加到146.2HV和440MPa,分别增加了13%和16%。而电导率仅从66.8%IACS下降到65.1%IACS;提高Cu-0.50Cr-0.10Co合金的时效温度并不能提高合金的综合性能。在实际生产中,Cu-0.50Cr-0.10Co合金的时效温度要控制在450℃以下;Cu-0.50Cr-0.07Ti合金的抗拉强度和电导率分别达到450MPa和73.1%IACS,Ti元素的强化效果明显优于Co元素的,且对Cu-0.50Cr合金的导电性能影响更小。
Cu-0.50Cr-xCo and Cu-0.50Cu-0.07Ti alloys were prepared by vacuum melting.The effects of Co content,deformation ratio,aging temperature and alloying element Ti on the microstructure and properties of the alloys were investigated.The results show that with the increase of Co content,undissolved Cr particles gradually appear at the grain boundary of Cu matrix.With the increase of deformation,the microhardness and tensile strength of Cu-0.50Cr-xCo alloy are increased from 129.1 HV and 379 MPa to 146.2 HV and 440 MPa,respectively,which are increased by 13%and 16%,respectively.Meanwhile,the conductivity is only decreased from 66.8%IACS to 65.1%IACS.Increasing the aging temperature cannot improve the comprehensive performance of Cu-0.50Cr-0.10Co alloy.During actual production,the aging temperature of Cu-0.50Cr-0.10Co alloy should be controlled below 450°C,so that the tensile strength and electrical conductivity of Cu-0.50Cr-0.07Ti alloy can reach 450 MPa and 73.1%IACS,respectively.The strengthening effect of Ti is better than that of Co,and it shows less influence on the conductivity of Cu-0.50Cr alloy.
作者
陈世康
陈小红
刘平
王卫东
谢浩峰
黄国杰
彭丽军
刘文
付少丽
刘科杰
CHEN Shikang;CHEN Xiaohong;LIU Ping;WANG Weidong;XIE Haofeng;HUANG Guojie;PENG Lijun;LIU Wen;FU Shaoli;LIU Kejie(School of Materials Science and Engineering,University of Shanghai for Science and Technology,Shanghai 200093,China;China Academy of Railway Sciences Co.,Ltd.,Beijing 100081,China;GRIMAT Engineering Institute Co.,Ltd.,Beijing 101407,China;Centuray Technology Co.,Ltd.,Changzhou 213011,China)
出处
《有色金属材料与工程》
CAS
2020年第5期1-8,共8页
Nonferrous Metal Materials and Engineering
基金
国家自然科学基金资助项目(No.51201107)
信程瑞技术有限公司项目。
