期刊文献+

Reduction of interfacial thermal resistance of overlapped graphene by bonding carbon chains

原文传递
导出
摘要 Exploring the mechanism of interfacial thermal transport and reducing the interfacial thermal resistance are of great importance for thermal management and modulation.Herein,the interfacial thermal resistance between overlapped graphene nanoribbons is largely reduced by adding bonded carbon chains as shown by molecular dynamics simulations.And the analytical model(phonon weak couplings model,PWCM)is utilized to analyze and explain the two-dimensional thermal transport mechanism at the cross-interface.An order of magnitude reduction of the interfacial thermal resistance is found as the graphene nanoribbons are bonded by just one carbon chain.Interestingly,the decreasing rate of the interfacial thermal resistance slows down gradually with the increasing number of carbon chains,which can be explained by the proposed theoretical relationship based on analytical model.Moreover,by the comparison of PWCM and the traditional simplified model,the accuracy of PWCM is demonstrated in the overlapped graphene nanoribbons.This work provides a new way to improve the interfacial thermal transport and reveal the essential mechanism for low-dimensional materials applied in thermal management.
作者 Yuwen Huang Wentao Feng Xiaoxiang Yu Chengcheng Deng Nuo Yang 黄钰文;冯文韬;余晓翔;邓程程;杨诺(School of Energy and Power Engineering,Huazhong University of Science and Technology,Wuhan 430074,China;State Key Laboratory of Coal Combustion,Huazhong University of Science and Technology,Wuhan 430074,China)
出处 《Chinese Physics B》 SCIE EI CAS CSCD 2020年第12期56-62,共7页 中国物理B(英文版)
基金 Project supported by the National Natural Science Foundation of China(Grant No.51606072) the Fundamental Research Funds for the Central Universities,HUST,China(Grant No.2019kfyRCPY045)。
  • 相关文献

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部