摘要
研究铜的表面微纳米结构制备工艺并进行了优化.使用碳酸钠和钼酸钠的水溶液作为电解液,在恒定电压下对铜表面进行阳极氧化,在铜表面生成一层氧化膜.使用磷酸和磷酸二氢钠的水溶液作为腐蚀液,对铜表面进行腐蚀处理,以在铜表面获取微纳米结构,并在扫描电镜下观察其形貌.统计分析扫描电镜图片,计算得到铜表面的微纳米结构的孔隙率.结果表明:阳极氧化电压为15 V,阳极氧化时间为20 min,磷酸质量分数为20%,腐蚀时间为30 min时,铜的表面形貌较为平整,孔隙率达到25.77%.根据正交实验结果,腐蚀液种类、浓度以及腐蚀时间对孔隙率的影响较大,而阳极氧化电解液、电压以及电解时间影响不明显.使用阳极氧化和化学腐蚀相结合的方法可以在铜表面制备出均匀、孔隙率高的微纳米结构.
The preparation technology of micro-nano structure on copper surface is studied and optimized.Aqueous solution containing sodium carbonate and sodium molybdate is used as electrolyte,and the copper sample is anodized at a constant voltage to form a layer of oxidation on the copper surface.Then,the copper surface is treated with aqueous solution containing phosphate and sodium dihydrogen phosphate as corrosion solution to obtain a micro-nano structure on the copper.The surface is observed by using a scanning electron microscope.Finally,the analysis software is used to analyze the scanning electron microscope image to calculate the micro-nano structure pores on the copper surface.The results show that when the anodizing voltage is 15 V,the anodizing time is 20 min,the phosphoric acid mass fraction is 20%,and the corrosion time is 30 min,the copper surface is relatively smooth,and the porosity reaches 25.77%.Orthogonal experiments demonstrate that the type,concentration of the corrosive solution,and etching time have a great effect,while the anodizing electrolyte,voltage and electrolysis have no significant effect on the porosity.Using a combination of anodic oxidation and chemical corrosion,micro and nano junctions with uniform and high porosity can be prepared on the copper surface.
作者
郭荣盛
胡广洪
荣建
王元龙
GUO Rongsheng;HU Guanghong;RONG Jian;WANG Yuanlong(Institute of Plastic Forming Technology and Equipment,Shanghai Jiao Tong University,Shanghai 200030,China)
出处
《上海交通大学学报》
EI
CAS
CSCD
北大核心
2021年第1期96-102,共7页
Journal of Shanghai Jiaotong University
关键词
铜
表面处理
纳米注塑
阳极氧化
微纳结构
copper
surface treatment
nano injection molding
anodic oxidation
micro-nano structure
