摘要
对微波MMIC芯片瞬态热特性测试进行了归纳和分析,借鉴传统热特性分析的数学处理方式,根据红外测试中施加周期脉冲的实际情况,结合周期脉冲热特性数学解析,对红外测试采集的升温过程数据进行处理,得到MMIC芯片热特性参数,并对红外实测瞬态温度变化和拟合数值进行了实际验证。与传统电学法和红外法热阻测试相比,本文分析了MMIC芯片实际射频工作脉冲状态下瞬态温升幅度、分布等数据,还得到了MMIC芯片的热特性参数和底部温度。
The transient thermal test of microwave MMIC chip was summarized and analyzed.By referring to the mathematical processing method of traditional thermal characteristics analysis,according to the actual situation of applying periodic pulse in infrared test,and combining with the mathematical analysis of periodic pulse thermal characteristics,the heating process data collected by infrared is processed,and the thermal characteristic parameters of the MMIC chip are obtained.The measured transient temperature change and the fitting value are verified.Compare with the traditional electrical and infrared method thermal resistance tests,the transient temperature rise amplitude,distribution and other data of the MMIC chip under the actual RF pulse working state can be analyzed,and the thermal characteristic parameters and bottom temperature of the MMIC chip can be obtained.
作者
贾东铭
王朝旭
JIA Dongming;WANG Zhaoxu(Nanjing Electronic Devices Institute,Nanjing,210016,CHN)
出处
《固体电子学研究与进展》
CAS
北大核心
2020年第6期461-465,共5页
Research & Progress of SSE
关键词
热特性
微波MMIC芯片
电学法
红外法
thermal characteristic
microwave MMIC chip
electrical method
infrared method
