摘要
有机硅凝胶凭借其优异的电绝缘和机械性能,广泛应用于IGBT器件的封装绝缘。该文详细介绍有机硅凝胶的制备工艺,改进了脱气曲线,解决传统工艺制备的样品在高温下出现气泡的问题。此外,考虑到IGBT器件在运行过程中产生大量的热量,热量作为副产物影响绝缘材料的性能,该文使用改进的脱气曲线制备了有机硅凝胶样品,通过实验得出不同温度下样品击穿电压的韦伯分布,获得温度对有机硅凝胶工频电击穿的影响规律并分析影响机制。该研究将为硅凝胶在高压IGBT功率器件的封装设计中提供重要的实用信息。
Silicone gel is a prevailing material for the encapsulation of IGBT power modules due to its excellent electrical insulation and mechanical properties.In the paper,the preparation process of silicone gel is elaborated.The improved vacuum degassing process is proposed,which can solve the problem that the bubbles are always generated in silicone gel at higher temperatures.In addition,the heat as a byproduct generated during the running of modules will result in temperature changes of the encapsulant.Therefore,the Weibull distributions of silicone gel sample,prepared in accordance with the improved degassing method,are measured under different temperatures.Then,the influence mechanism of temperature on the breakdown characteristic of silicone gel is analyzed.This paper can provide the practical information for the design of encapsulation in high voltage IGBT power modules.
作者
顼佳宇
李学宝
崔翔
毛塬
赵志斌
Xu Jiayu;Li Xuebao;Cui Xiang;Mao Yuan;Zhao Zhibin(State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources North China Electric Power University,Beijing 102206 China;Department of Electrical and Computer Engineering,Virginia Tech,Blacksburg 24060 USA)
出处
《电工技术学报》
EI
CSCD
北大核心
2021年第2期352-361,共10页
Transactions of China Electrotechnical Society
基金
国家自然基金与国家智能电网联合基金(U1766219)
中央高校基金(2019QN120)资助项目。
关键词
有机硅凝胶改进脱气曲线
工频电击穿特性
热性能
自由体积理论
Silicone gel
improved degassing process
breakdown characteristic under power frequency
thermal performance
free volume theory
