摘要
以微米级Cu粉为基体相,纳米Al_(2)O_(3)颗粒为绝缘相,采用机械球磨和放电等离子烧结工艺相结合的方法制备Al_(2)O_(3)/Cu复合材料,研究Al_(2)O_(3)含量对复合材料微观结构、电阻率和热导率的影响。结果表明,Al_(2)O_(3)/Cu复合材料为核−壳结构,随Al_(2)O_(3)含量增加,Al_(2)O_(3)包覆层对Cu基体的包覆效果逐渐提升;当w(Al_(2)O_(3))为5%时,Al_(2)O_(3)/Cu复合材料的热导率较高,为85.92 W/(m·K),但电阻率偏低,仅为12.6 mΩ·cm。当w(Al_(2)O_(3))增加至15%时,虽然Al_(2)O_(3)/Cu复合材料的密度降至6.69 g/cm^(3),孔隙率较高,但电阻率显著提高至2.09×10^(8) mΩ·cm,约为Cu电阻率的10^(11)倍,且热导率为7.6 W/(m·K),明显高于传统金属基板的热导率。
Al_(2)O_(3)/Cu composite materials,with micron Cu powders as matrix phase and nano Al_(2)O_(3) particles as insulating phase were prepared by mechanical ball milling combined with spark plasma sintering.The effects of Al_(2)O_(3) content on the microstructure,resistivity and thermal conductivity of the Al_(2)O_(3)/Cu composite materials were investigated.The results show that the Al_(2)O_(3)/Cu composite materials are core-shell structure.With the increase of Al_(2)O_(3) content,the covering effect of the Al_(2)O_(3) coating on the copper substrate is gradually enhanced.When w(Al_(2)O_(3))is 5%,the thermal conductivity of the Al_(2)O_(3)/Cu composites is relatively high,which is 85.92 W/(m·K),but the resistivity is relatively low(12.6 mΩ·cm).When w(Al_(2)O_(3))increases to 15%,the density of the Al_(2)O_(3)/Cu composites decreases to 6.69 g/cm^(3) and the porosity is higher.But the resistivity significantly increases to 2.09×10^(8) mΩ·cm,which is about 10^(11) times of Cu and the thermal conductivity is 7.6 W/(m·K),which is obviously higher than that of the traditional metal substrate.
作者
张阳琳
罗自贵
胡晓明
冯波
李如松
樊希安
ZHANG Yanglin;LUO Zigui;HU Xiaoming;FENG Bo;LI Rusong;FAN Xi’an(The State Key Laboratory of Refractories and Metallurgy,Wuhan University of Science and Technology,Wuhan 430081,China;Key Laboratory for Ferrous Metallurgy and Resources Utilization of Ministry of Education,Wuhan University of Science and Technology,Wuhan 430081,China)
出处
《粉末冶金材料科学与工程》
EI
2021年第1期9-14,共6页
Materials Science and Engineering of Powder Metallurgy
基金
国家自然科学基金资助项目(51674181)。
