摘要
高压模拟开关在现代超声领域发挥关键作用。综合考量传输速度、导通电阻、通道隔离度等性能指标,利用红外热成像技术解决了电路漏电的失效问题。该技术包括红外热成像、漏电失效分析、漏电测试、器件原理分析及漏电解决方案等措施,提出了高压模拟开关器件漏电失效问题的通用解决方法,对高压模拟开关漏电失效问题的解决具有较高的参考价值。另外,该方法通过对器件内部工艺结构的分析,发现了器件漏电失效的本质因素,对后续器件工艺结构的改进具有一定的指导意义。
High voltage analog switch plays a key role in modern ultrasonic field.Performance indicators such as transmission speed,conductive resistance and channel isolation are sonsidered comprehensively.The problem of circuit leakage failure is solved by infrared thermal imaging technology.The method includes infrared thermal imaging,leadkage failure analysis,leakage testing,device principle analysis and leakage solutions.A general solution for leakage failure of high voltage analog switching devices is presented.It is of great significance to solve the leakage failure problem of high voltage analog switch.In addition,the method analyzes the internal process structure of the device,the essential factor of leakage failure is found.It has some guiding significance for the subsequent improvement of device process structure.
作者
黄立朝
阎燕山
程绪林
张如州
HUANG Lichao;YAN Yanshan;CHENG Xulin;ZHANG Ruzhou(China Key System&Integrated Circuit Co.,Ltd.,Wuxi 214072,China;Aeronautical Radio Electronics Research Institute,Shanghai 201100,China)
出处
《电子与封装》
2021年第4期67-70,共4页
Electronics & Packaging
关键词
高压开关
漏电失效
系统结构
high voltage switch
leakage failure
system structure
