摘要
本文针对添加剂对铜电沉积机理的影响进行了研究,并采用控制变量法研究了MPS、DDAC、Cl^(−)对铜箔电沉积的影响,以探索MPS与DDAC对铜箔晶体择优和微观形貌的协同影响作用。结果表明,在基础镀铜液确定的条件下,MPS单独存在可以增大阴极极化和成核数密度,减小Cu2+扩散系数;DDAC可以增大阴极极化,其浓度与Cu2+扩散系数呈负相关,与成核数密度呈正相关;Cl^(−)本身对阴极极化作用并不明显,但会改变铜电结晶过程的成核方式。MPS、DDAC和Cl^(−)协同作用时,随着MPS浓度增加,扩散系数和成核数密度最终趋于一定值,MPS浓度达到10 mg/L后只有(220)晶面择优,此时镀层平整性最优。
In this paper,the effect of additives on copper electrodeposition mechanism was studied,and the influence of MPS,DDAC,Cl^(−) on copper foil electrodeposition was studied by using the control variable method,so as to explore the synergistic effect of MPS and DDAC on the crystal preference and micro morphology of copper foil.The results show that under the condition that the basic copper plating bath is determined,the presence of MPS alone can increase the cathodic polarization and nucleation number density,and reduce the diffusion coefficient of Cu2+;DDAC can increase the cathodic polarization,and its concentration has a negative correlation with the diffusion coefficient of Cu2+and a positive correlation with the nucleation number density;Cl^(−) itself has no obvious effect on the cathodic polarization,but will change the nucleation mode of copper during the process of electrocrystallization.When MPS,DDAC and Cl^(−) work together,as the MPS concentration increases,the diffusion coefficient and nucleation number density eventually tend to a certain value.When the MPS concentration reaches 10 mg/L,only(220)crystal face is preferred,and the coating has the best flatness.
作者
王羽
刘励昀
杜荣斌
刘涛
陆冰沪
李大双
WANG Yu;LIU Liyun;DU Rongbin;LIU Tao;LU Binghu;LI Dashuang(School of Chemistry and Chemical Engineering,Anqing Normal University,Anqing 246133,China;Anhui Tongguan Copper Foil Group Co.,Ltd.,Chizhou 247100,China)
出处
《电镀与精饰》
CAS
北大核心
2021年第5期1-9,共9页
Plating & Finishing
基金
安徽省科技重大专项(18030901069)
安徽省高校学科(专业)拔尖人才学术资助项目(gxbjZD202075)。
关键词
电沉积
极化作用
成核密度
择优取向
微观形貌
electrodeposition
polarization
nucleation density
preferential orientation
microscopic morphology
