摘要
为了研究电子设备在温度较高的环境下电路板元器件散热和在温度载荷下引起的变形,通过ANSYS数值模拟的方法建立流热耦合的电路芯片散热模型,对芯片与电路板表面形成冲击压力进而导致热疲劳进行研究,分析与讨论温度对流场与静力学结构的影响。通过数值模拟分析得出:电路板为铝材质的变形很大,变形从中间凸起;而PCB材料电路板的变形不是局部变形,属于扩散式变形。
In order to study the heat dissipation of circuit board components and the deformation caused by temperature load in electronic equipment in a high temperature environment,the heat dissipation model of the circuit chip with flow-thermal coupling was established by the ANSYS numerical simulation method,and the impact pressure formed on the surface of the chip and the circuit board leading to thermal fatigue was studied,and the influence of temperature on the flow field and static structure was analyzed and discussed.Through numerical simulation analysis,it was concluded that the deformation of the circuit board made of aluminum was large,and the bulged deformation appeared in the middle;while the deformation of the PCB material circuit board was not a local deformation,it was a diffusion deformation.
作者
余建平
刘雨
韩永东
王美琪
胡爽
张佩
焦艳平
孟成峰
YU Jian-ping;LIU Yu;HAN Yong-dong;WANG Mei-qi;HU Shuang;ZHANG Pei;JIAO Yan-ping;MENG Cheng-feng(School of Petrochemical Engineering,Lanzhou University of Technology,Lanzhou 730050,China)
出处
《当代化工》
CAS
2021年第3期554-557,共4页
Contemporary Chemical Industry
基金
甘肃省自然科学基金(项目编号:1610RJZA029)。
关键词
芯片散热
ANSYS
应力
变形
流热固耦合
Chip heat dissipation
ANSYS
Stress
Deformation
Fluid-heat-solid coupling
