摘要
为了提高热电制冷箱的制冷性能,对市面上常见的热电(半导体)制冷箱进行分析,并对制冷箱的制冷装配体与箱壁之间的架构方式进行探究。采用仿真工具SolidWorks Flow Simulation对制冷箱的制冷装配体与箱壁之间的架构方式进行建模仿真。分析了重力、风扇方向、开槽尺寸、槽内所加支架等参数对半导体制冷箱制冷性能的影响规律,结果表明:制冷箱在开槽尺寸一定时,重力方向处于箱体尺寸最长边,风扇进气方向为吸气,槽内加对称支架,并对支架的4个侧面做尽可能多的圆形镂空处理,且圆越大越好,此时热电制冷箱的制冷性能最优。
In order to improve the refrigeration performance of thermoelectric refrigeration box,the common thermoelectric(semiconductor)refrigeration box on the market was analyzed,and the structure between the refrigeration assembly of the refrigeration box and the wall of the box was explored.SolidWorks Flow Simulation was used to model and simulate the structure between the refrigeration assembly and the wall of the refrigeration box.The effects of gravity,fan direction,groove size and bracket on the refrigeration performance of semiconductor refrigeration box were analyzed.It is concluded that when the groove size is fixed,the cooling performance of thermoelectric refrigeration box is optimal when the gravity direction is at the longest side of the box size,the direction of fan intake is suction and symmetrical bracket is added in the groove.The four sides of the support are cut out as many circles as possible,and the larger the circle is,the better.
作者
邵夏勇
张治国
李国能
叶阳辉
邓斌
王晴
Obinani Victor Chimdike
SHAO Xiayong;ZHANG Zhiguo;LI Guoneng;YE Yanghui;DENG Bin;WANG Qing;Obinani Victor Chimdike(School of Mechanical and Energy Engineering,Zhejiang University of Science and Technology,Hangzhou 310023,Zhejiang Province,China)
出处
《发电技术》
2021年第3期374-381,共8页
Power Generation Technology
基金
国家自然科学基金项目(51776188)。
