摘要
为了研究单晶硅中纳米裂纹对加工过程的影响,建立了单晶硅纳米压痕的分子动力学模型。在该研究中,分析了不同压痕速度对单晶硅中纳米裂纹演化的影响。对纳米压痕工艺、温度变化、势能变化、加载力、裂纹扩展、配位数等进行了深入的研究。研究结果表明,工件中的纳米裂纹在加载过程中有愈合的趋势;压头加载速度越大,工件纳米压痕区温度越高,势能越大,但加载速度对载荷变化趋势的影响不大;另外,纳米裂纹会使工件中Bct5-Si与Si-II的量显著下降。该研究为包含缺陷的单晶硅半导体的实际加工提供了理论指导。
In order to study the effect of nano cracks in monocrystalline silicon on the machining process,a molecular dynamics model of nano indentation in monocrystalline silicon was established.In this study,the influence of different indentation speed on the evolution of nano cracks in monocrystalline silicon was analyzed.The nanoindentation process,temperature change,potential energy change,loading force,crack propagation and coordination number were studied.The results show that the nano cracks in the workpiece tend to heal during the loading process;The higher the indenter loading speed is,the higher the temperature of the nano indentation zone of the workpiece is,and the greater the potential energy is,but the loading speed has little effect on the load variation trend;In addition,the amount of Bct5 Si and Si II in the workpiece decreases significantly due to nano cracks.This study provides theoretical guidance for the practical processing of monocrystalline silicon semiconductors with defects.
作者
胡洋
戴厚富
周玉琪
岳海霞
HU Yang;DAI Hou-fu;ZHOU Yu-qi;YUE Hai-xia(School of Mechanical Engineering,Guizhou University,Guiyang 550000,China)
出处
《组合机床与自动化加工技术》
北大核心
2021年第6期25-28,共4页
Modular Machine Tool & Automatic Manufacturing Technique
基金
国家自然科学基金青年项目(51805102)
中国博士后科学基金(2019M662765)
贵州省科学技术基金一般项目(黔科合基础[2020]1Y227)。
关键词
分子动力学
纳米裂纹
纳米压痕
molecular dynamics
nano crack
nano indentation
